Electronics Forum | Tue May 06 22:54:08 EDT 2003 | davef
tommyg_fla. Sorry about being late getting back you. Surface-active species, such as Fe2+, Mn2+, NH4+, and H+, can be adsorbed onto solid phases [and transported by things as weird as bioturbation or advection not that they have anything to do with
Electronics Forum | Tue Oct 05 04:01:36 EDT 1999 | Brian
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Thu Jul 04 23:17:24 EDT 2019 | 123456789
Today we will talk some other problems you may meet in the wedge bonding work. If you have any other supplement or suggestion, welcome to leave us message. Appear welding spot indentation on the frame, what's the causes? How to solve? 1.The Wedge’s
Electronics Forum | Tue Nov 07 02:50:41 EST 2000 | CharTrain
A solder wetting balance will indicate a time of less than one second for wetting to occur to a solderable surface. The additional time is required to get the metalized surfaces up to soldering temperature. A single sided board has very little mass a
Electronics Forum | Fri Jan 09 08:59:49 EST 1998 | Stefan Witte
| A potential purchaser of our products (switchmode power supplies for telecommunications) has asked what the benefits of SMT are to him. | Our marketing people wish to obtain a list of the benefits of SMT to the purchaser of the end product. i.e. th
Electronics Forum | Mon Jun 12 09:47:18 EDT 2006 | patrickbruneel
Hi Grant, You definitely have a pre-heat problem and not a flux problem. Pallets together with the BNC connectors put a large thermal demand on your pre-heating. 3 zones would be a good investment even with leaded solder due to the high thermal dema
Electronics Forum | Mon Aug 13 10:51:14 EDT 2007 | davef
This sounds like sales-type teaser posting, but let's see what we get. When comparing convection to IR BGA rework stations, IR stations perform poorly when: * Evaluation board has no power and ground planes. Worst case PWB as IR energy from bottom h
Electronics Forum | Tue Feb 20 19:12:07 EST 2001 | billschreiber
Hello Kerry, If your stencils are going back into inventory rather than into production, expediting the drying process may not be necessary. Just place them on a rack and allow them to air dry naturally. That way you can maximize the throughput of
Electronics Forum | Wed Feb 20 15:20:34 EST 2013 | hegemon
Depending on your requirements, you could range from a hair dryer, heat gun, toaster oven, hot plate, on up to digitally controlled surfaces and convective systems. You'll have to gauge for yourself whether you are just trying to add some heat energy
Electronics Forum | Tue Apr 11 20:26:16 EDT 2000 | Dave F
Jeremy: Parts assembler make leads of either Alloy 42 (Invar, whatever) or copper. The solderability of these leads are protected with eutectic or non-eutectic tin/lead solder, palladium or some palladium alloy, or gold. Cuppla things to consider:
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