Electronics Forum | Fri Dec 27 14:24:15 EST 2019 | ameenullakhan
Yes we have tried with low soak with longer reflow and high peak also low soak.. short TAL and low peak.. but were not able to eliminate the issue
Electronics Forum | Thu May 20 03:45:22 EDT 2021 | jineshjpr
SAC305 Will be the best choice with minimum TAL, Maximum Soak Solder Profile. Surely your solder Joint strength also will be more reliable & This can pass any kind of reliable Tests.
Electronics Forum | Mon Jan 09 17:52:50 EST 2023 | duchoang
The reasons could be: -The pads size are uneven. Modify the pads size. -The part has not enough time for self-centering. Check and increase TAL. -Solderpaste not melted completely. Increase peak temp. -Solderpaste does not work well. Use alternate so
Electronics Forum | Thu Aug 17 12:48:40 EDT 2023 | denism
Measure the temperature of the central and edge balls. There should be minimal difference in peak temperature and TAL offset. If not, correct reflow profile. For correct reflow profile your BGA mus be backed befor use.
Electronics Forum | Wed Mar 24 10:04:09 EST 2004 | Marc Apell
183C, 60 +- 15 seconds). The quesiton to use a straight ramp or soak profile comes down to the product your are soldering. The key is to get the whole assembly at the same peak temp (minimized delta) and same TAL for effective formation of the so
Electronics Forum | Tue May 13 09:58:50 EDT 2008 | rgduval
Thanks, Dave, To the 183 TAL...I was just referencing a previous post I found in the archives. We checked the profile on the board this morning, absed on the temp info that AIM recommended, and found that we're above liquidous for nearly 2 minutes!
Electronics Forum | Wed Aug 27 14:38:20 EDT 2008 | rgduval
Does your paste provider recommend a TAL? For the leaded and lead-free pastes that we use, the manufacturer recommends 60 seconds above liquidous. I note that your profile shows the TAL as 30 seconds, which may not be sufficient. That said, tho
Electronics Forum | Wed Sep 23 03:43:31 EDT 2009 | d0min0
hello, we are profiling with the pcb each day - results are very good with a small delta we made another test board with TC only in the problem places - same good result we tried 500-600 boards on 12 zone machine - zero defects while on standard 6
Electronics Forum | Fri Dec 15 11:45:38 EST 2000 | DaveJ
All, Thanks for your quick response. However, my primary concern is not the question of solderability advantages of nitrogen versus air. With all things (zone temps, track speeds, flow rates, etc.) being equal, what would be the profile differences o
Electronics Forum | Mon May 06 16:14:41 EDT 2002 | russ
Would the lead finish on this part happen to be Paladium? I had a problem similar to this some time ago and we found the lead finish was not tin/lead over copper but paladium over nickel. We had to increase the reflow to 225 deg. C peak temp with t
