Electronics Forum | Thu Feb 21 16:57:02 EST 2008 | flipit
If the vias are large and don't always tent, you can have your pcb supplier double mask the pcb. I do this for COB assembly sometimes because the globtop wicks through the vias and also causes air bubbles in the globtop.
Electronics Forum | Fri Jan 21 19:30:11 EST 2005 | Dreamsniper
Hi T2, The purpose of this is that we want to make our rework robust. Whenever we rework BGA's we have solder getting trapped into those 1 sided tented vias and bet yah...they are hard to desolder! And during BGA resoldering these trapped solder will
Electronics Forum | Thu Feb 21 17:19:08 EST 2008 | davemn
if you are not using them for test points or want them filled with solder for current carrying capability then tent them puppies. i was able to move our company away from exposed vias many years ago and this eliminated lots of hairline shorts between
Electronics Forum | Tue Nov 28 16:28:14 EST 2000 | CAL
Chris- The machines you identified are stable products and have been around for over two years now and most bugs have been worked out. The F5 IC head has not changed much since its introduction over 5 years ago. Remember these machine like to run, r
Electronics Forum | Mon Feb 25 12:21:16 EST 2008 | stevek
Rather than having the artwork cover the via as with tenting dry film, and letting the mask do what it will, the preferred way is to do a second op silk screen with something like SR1000 just in the vias themselves to plug them. This doesn't always
Electronics Forum | Tue Mar 19 17:30:46 EST 2002 | rculpepp
Does anyone have or know of any published guidelines for BGA layout on PWB's so that they can be tested. Specifically using micro vias? If anyone has any input regarding other test considerations for BGA devices I'd like to hear from you as well. W
Electronics Forum | Thu Feb 21 14:54:36 EST 2008 | shrek
KRIKIES! tenting WILL inhibit solder flow through the top-side me lad. In the meantime, me chap, have you tried to adjust wave parameters? i've read threads here that a vibrating wave will tend to push solder up through holes.
Electronics Forum | Tue Mar 04 15:34:31 EST 2003 | ROHAN SARKER
Well very interesting...i think a possible solution can be data acquisition via Matlab and then carrying the necessary operations.Can u give details of your works-----I can then get closer to a possible solution.
Electronics Forum | Thu Jul 08 13:30:02 EDT 2004 | Daan Terstegge
I would be glad to host your paper on http://www.smtinfo.net. You can email me via the link on my site. Daan Terstegge http://www.smtinfo.net
Electronics Forum | Tue Mar 22 08:05:59 EST 2005 | jdumont
Morning all, my question is regarding the use of filled/tented/plugged vias on the BGA site. What are you guys doing for this? What type of issues can this cause if using none, or the improper via design. Regards, JD
