Electronics Forum | Sat Nov 17 18:29:02 EST 2007 | bbarton
Let's face it guys...in most cases (stress the MOST!) a typical FR4 board will do the job. Few layers, low copper, not too densly populated etc...no worries. Use a reflow profile which avoids the 245-250C range, use a shorter TAL, Viola you have a go
Electronics Forum | Fri Aug 21 04:43:14 EDT 2009 | ghepo
Hello, I suggest you visit the website http://www.analysispcb.com, where I found these information : PARAMETERS FOR DOUBLE “V” SCORING LEAD FREE LAMINATES Typ WEB Thickness, 1.6mm : 0.38mm (+.15/-0) "...Tg is not a good indicator of a materials’
Electronics Forum | Thu Jan 19 21:43:33 EST 2006 | davef
Specifically, what element of the bare board is blistering? Tg of 140 could be acceptable. Search the fine SMTnet Archives for background on decomposition temperature [td]
Electronics Forum | Fri Feb 24 10:21:59 EST 2006 | Board House
TM, When picking a material for your lead free assembly you need to think about a couple of things, The standard Material in the US that is being used is running 140 - 170 tg. material. But for lead free assembly you need to focus on is Decomp tem
Electronics Forum | Wed Nov 28 22:33:24 EST 2007 | davef
There is no specification for lead-free HASL. You can use any lead-free solderability protection that meets your customer requirements. Use IPC-9701 �Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments� to ass