Electronics Forum | Wed Aug 12 22:28:20 EDT 2009 | boardhouse
When choosing materials, do you specify your > thermal PCB needs? For instance, are you > specifying temperature or are you selecting > materials by brand name? With this type of product I would call out the material Manufacture and brand - Such
Electronics Forum | Sun May 19 23:38:57 EDT 2013 | shrikant_borkar
We are EMS. Later revisions and Other models are get Modified. Now we have some remain Stock of Pcbs abd there end also. We have taken trial with Reduction in Apparatuses. But even small amount of solder paste at thermal Pad is causing QFN lift up.
Electronics Forum | Thu Jun 18 10:57:28 EDT 1998 | Mike Moninger
| We offer an upgrade service for notebooks with 486 SX/DX CPUs up to 586-133 MHz using the AMD 5x86-133 MHz CPU in the PQFP package. We are pretty succesful with this service and until today we did more than 1000 notebook upgrades this way. | Now,
Electronics Forum | Wed Aug 01 11:11:38 EDT 2001 | JohnW
hi Folk's, Ok so I'm looking for some thoughts on Conductive Epoxy's. I'm trying to replace a material that i can place between a QFP and the PCB to transfer heat from the component to the PCB. The material has to be able to be injected thro' a hole
Electronics Forum | Mon Jun 06 09:05:02 EDT 2005 | cmiller
How do apply it in your process? It would seem best to screen the electrically conductive epoxy then dispense the thermally conductive epoxy to bond the part to the heat sink pad. Any help or opinions would be appreciated. I dont think the System Uni
Electronics Forum | Mon Jun 06 10:02:39 EDT 2005 | cmiller
How do apply it in your process? It would seem best to screen the electrically conductive epoxy then dispense the thermally conductive epoxy to bond the part to the heat sink pad. Any help or opinions would be appreciated. I dont think the System Uni
Electronics Forum | Mon Feb 05 10:21:21 EST 2007 | davef
Thermal conductivity [W/m-�C] * Silver: 418 * Aluminum: 403 * Copper [rolled annealed]: 392 * Copper [electrodeposited]: 392 * Gold: 297 * Nickel: 90.7 * Tin: 73 * SAC: 73 * Castin: 57 * Pb37Sn63: 51 * Lead: 35 * Epoxy, phenolic: 25-75 * Conformal co
Electronics Forum | Wed Mar 15 04:36:16 EDT 2017 | Rob
@ Sr.Tech, Any voiding means that the part of the package under the void is not forming a solid thermal interface with the PCB, therefore it's heatsinking capability is reduced. With the drive for smaller packages with higher power handling capabil
Electronics Forum | Wed Oct 04 00:47:57 EDT 2017 | silversurfer11
Hello, I am experiencing a high pitched noise coming from a computer component and I think it might be the 18 inductors they have placed on the PCB as part of the VRM. I am think of using a 2 part Thermal Conductive Adhesive and fix all the inducto
Electronics Forum | Wed Mar 15 08:18:29 EDT 2017 | rob
It's well documented in higher power semiconductors where thermal interface materials are used, such as SIL pads, thermal grease etc. There are a couple of papers on the effects of voiding on MOSFET performance, but I haven't got around to reading