Electronics Forum: thermal pad (Page 5 of 51)

SMD Via hole design-thermal performance

Electronics Forum | Sat Nov 01 09:40:05 EDT 2014 | davef

Papers: GOOGLE thermal pad via

28 pin QFN Pads.

Electronics Forum | Wed Sep 15 10:59:12 EDT 2010 | asksmt

Thanks for the valueable feedback, I have two questions 1. why do you have to extend the pad size ? is it okay if i keep pad size 2. I am currently using thermal pad size recommended in datasheet max value 4.2mm x 4.2mm, how much should i shrink

Importance of Exposed Pad In ST QFP for Set top box product

Electronics Forum | Thu Oct 01 08:34:50 EDT 2009 | davef

First, the reflow thermal recipe provided by your paste supplier is only a ball park guess. Beyond that, the temperature measured by thermocouples on your oven heaters are only loosely related the temperature of solder paste on your board. You need t

Solder balls under LLP

Electronics Forum | Thu Sep 01 09:05:47 EDT 2005 | russ

Thermal pads located underneath leadless devices require a 50% reduction in the stencil aperture.

LLP Device

Electronics Forum | Mon Mar 13 09:14:18 EST 2006 | russ

Thanks A.J. knew about the thermal pad reduction but not the overprint. off to CAD!

QFNs (LCCs)

Electronics Forum | Thu Dec 21 15:34:48 EST 2006 | russ

we are reducing the thermal pad stencil apertures by 40% on these with great results Russ

Best way to ensure max solder load on SOIC w Thermal Pad

Electronics Forum | Tue Nov 09 17:38:01 EST 2010 | davef

What's your stencil thickness?

Thermal Pads Soldering Worry, can anybody help?

Electronics Forum | Tue Aug 01 22:13:18 EDT 2017 | heros_electronics

Thanks Dawson! it seems that it is helpful.

Thermal Pads Soldering Worry, can anybody help?

Electronics Forum | Tue Aug 01 22:21:22 EDT 2017 | heros_electronics

Really thanks for your help. I agree that this is the contradiction.

QFN standoff, industry standard

Electronics Forum | Wed Jul 03 09:47:39 EDT 2019 | SMTA-Pat

We have seen that vias included in the PCB under the thermal pad will give less voiding.


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