Electronics Forum: thermal pad (Page 5 of 49)

Solder balls under LLP

Electronics Forum | Thu Sep 01 09:05:47 EDT 2005 | russ

Thermal pads located underneath leadless devices require a 50% reduction in the stencil aperture.

LLP Device

Electronics Forum | Mon Mar 13 09:14:18 EST 2006 | russ

Thanks A.J. knew about the thermal pad reduction but not the overprint. off to CAD!


Electronics Forum | Thu Dec 21 15:34:48 EST 2006 | russ

we are reducing the thermal pad stencil apertures by 40% on these with great results Russ

Best way to ensure max solder load on SOIC w Thermal Pad

Electronics Forum | Tue Nov 09 17:38:01 EST 2010 | davef

What's your stencil thickness?

Thermal Pads Soldering Worry, can anybody help?

Electronics Forum | Tue Aug 01 22:13:18 EDT 2017 | heros_electronics

Thanks Dawson! it seems that it is helpful.

Thermal Pads Soldering Worry, can anybody help?

Electronics Forum | Tue Aug 01 22:21:22 EDT 2017 | heros_electronics

Really thanks for your help. I agree that this is the contradiction.

QFN standoff, industry standard

Electronics Forum | Wed Jul 03 09:47:39 EDT 2019 | SMTA-Pat

We have seen that vias included in the PCB under the thermal pad will give less voiding.

SMD module moving during reflow

Electronics Forum | Wed Jun 19 17:44:38 EDT 2019 | slthomas

Does the part have a ground/thermal pad underneath or are all terminations on the perimeter?

Stencil design

Electronics Forum | Fri Mar 02 16:26:57 EST 2007 | Steve

1- Thickness 0.005" 2- I usually reduce 50% of the thermal pad, but it also depend on original size of thermal pad somehow I have to either create window panel or crosshatch otherwise component wil get wimming during reflow. Hope this will help. Reg


Electronics Forum | Fri Apr 25 12:36:52 EDT 2008 | fsw

All, Does anyone on the forum have experience with underfill? We have a component with QFN pkg on one of the new products. It has a thermal pad in the centre. Customer wants this component to have an underfill. Questions - 1) Does one normally req

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