Electronics Forum | Tue Jun 03 13:25:46 EDT 2008 | slthomas
I'm in the same boat and have to pay a little more for the standards I insist on having. You just have to work on your sales pitch a little to convince the powers-that-be that you need it. Just tell them the difference is about $50k/year in scrap and
Electronics Forum | Tue Dec 18 10:14:14 EST 2012 | moshesh
In those cases where we have a 3.2mm thick, 16-layer board with several GND layers, do we still need ground connection to each and every layer (with thermal relief) or, skip part of the ground patterns? Will it help soldeing rising. I can't reach mor
Electronics Forum | Thu Jun 22 07:30:25 EDT 2017 | stephendo
Any possibility of having some changes made to the PCB for future runs? Can the ground connections be modified to have thermal relief patterns? At one time occasionally people would come to me to tell me that the power was out at their work station
Electronics Forum | Wed Jun 03 21:40:38 EDT 1998 | Dave F
| | Hello: | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints
Electronics Forum | Wed Jun 03 14:17:12 EDT 1998 | Earl Moon
| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op
Electronics Forum | Thu Jul 20 23:41:55 EDT 2017 | heros_electronics
Below is an email that I copy and pasted from my customer's engineer about his concerns with the issue of the chips not reflowing (which is why I was asking about X-ray the chips to make sure they reflowed): Can you let me know your thoughts on his
Electronics Forum | Mon Dec 18 16:13:15 EST 2006 | darby
AJ, No overprint. We have components in very close proximity that precluded that. Also we have differing areas of thermal relief for the pads from a large backplane, from none at all to open blocks to individual pad relief. After a few more experimen
Electronics Forum | Tue Jul 25 07:37:21 EDT 2017 | stephendo
There are lots of examples of changing a parameter in one direction to fix one issue causes a different problem. Once I asked a layout engineer to adjust thermal relief for through hole parts. First he said ok but a day later he said that he couldn't
Electronics Forum | Wed May 21 12:55:35 EDT 2003 | Zhenya
Several things for your reference: 1. Starting with data collection: - Have you done a measle chart to illustrate the pattern of the defect? - Have you checked the corelation between shift/time and defects rate? - How about a pareto chart? - Do
Electronics Forum | Thu Sep 10 11:57:20 EDT 1998 | James Michaud
I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress reli
