Electronics Forum | Mon Dec 17 11:55:08 EST 2007 | chef
I recently had the same problems, solder bridges on every thing I made, different customers boards, etc. I wave with no-clean flux. As I sorted out problems (pin holes, blow holes, splatter, etc.) I found a lot of variable factors. I changed flux,
Electronics Forum | Tue Jan 23 11:55:27 EST 2001 | aiscorp
I gather from your question that you might have experienced large scale system implementation problems in the past, or at least fear experiencing it in the future. This is a very valid concern based on the performance of traditional CIM systems. Fo
Electronics Forum | Wed Oct 18 16:30:12 EDT 2000 | Dave F
No such thing. Check with your temperature measuring equipment supplier.
Electronics Forum | Sun Jun 07 02:06:26 EDT 1998 | Earl Moon
| Earl, | As always, I am interested in what you have to say, but I am still a little vague on your application of ANSI Y14.5 as it relates to the manufacturability of an assembled printed circuit board. Are you implying that component placement coor
Electronics Forum | Mon Jun 08 14:19:30 EDT 1998 | Gary Simbulan
Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We still have
Electronics Forum | Tue Aug 13 02:33:04 EDT 2019 | ameenullakhan
Hi , Thanks for the reply. Yes CCGA was checked before placement and sending to reflow oven. The latest suspect form few cross functional team member is like. It is due to improper reflow profile " Column kick out " has happen. I am
Electronics Forum | Sun Mar 22 14:28:35 EST 1998 | Martin Plourde
| Need to sell machine with about 40 feeders. Excellent conditions. Located in Melbourne Fl and asking $25K Send me more info as well as pictures if possible. What is the vintage, what is the output and where are you located. Regards, Martin Plourde
Electronics Forum | Fri Dec 06 19:22:50 EST 2019 | giangle711
Need help to locate freeware to be able to merge BOM and XY files in CSV/TXT.
Electronics Forum | Mon Dec 02 12:52:40 EST 2002 | slthomas
We're trying a selective soldering pallet for the first time with mixed reviews. Are solder balls a prevalent problem with this process? Most of them seem to correspond with pallet wall locations....is it too much turbulence from the rotary chip wav
Electronics Forum | Wed Jul 31 07:51:31 EDT 2019 | ameenullakhan
Hi Dave, lead is 80Pb/20Sn. Top joint off CCGA lead is SN63/Pb37. Thermocouple was placed at center lead of the CCGA and one at the corner lead of CCGA. Ramp Rate Center 1.09 Corner 1.26 Soak ( 140 - 160 deg C ) Center 37sec Corner 38sec Ref
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