Electronics Forum | Thu Sep 12 18:50:17 EDT 2002 | scottefiske
Sorry so late in getting into this tehcnical issue. I have seen this condition before...90% of the time in conditions of adhesion on a water soluble material... is the paste...exposure time, lot issue, etc..basically the paste's carriers and binders
Electronics Forum | Mon Sep 20 16:27:58 EDT 2004 | blnorman
Besides the processing tests (different print speeds, print delay times, etc.) one test we've had to use is humidity exposure. Solderballing due to high outside humidity is a problem in our plant. So we expose paste to 85% humidity for various time
Electronics Forum | Thu Sep 22 06:12:05 EDT 2005 | gavinscott
Hi All, I have been tasked with a project on the control of moisture sensitive devices and I was hoping to get some input from the experts out there... How do you monitor total exposure time for a MSD? If the packaging has been opened and re-sealed a
Electronics Forum | Wed Jan 23 18:15:33 EST 2008 | gsala
Hi, are you dealing with Leaded or Lead Free P-BGA ? soldering by Lead or Lead Free paste ? Any way, some time, bridges can be caused by moisture entrapped in the BGA body. Make sure if is respected the correct MSL's allowed flore exposure time, ot
Electronics Forum | Wed May 15 13:11:26 EDT 2002 | fmonette
Hi Dason, Yes I was talking about the same paper. This is the best technical information available to clearly explain the physics of moisture diffusion inside a plastic package. Many of the guidelines contained in the current J-STD-033 are derived
Electronics Forum | Fri Aug 22 13:55:24 EDT 2008 | jdumont
We have used the Cogiscan system successfully here for 3 years or so now I think its been. I couldn't possibly imagine tracking MSL's on a lot of parts by hand... and being able to trust your numbers. This software will track everything for you and a
Electronics Forum | Sun Apr 18 03:58:26 EDT 1999 | P.L. Sorenson - Technical Consultant
| While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | I thought I'd ask some experts. Any help guys? | To remove moisture from low quanti
Electronics Forum | Thu Aug 05 16:15:18 EDT 2004 | pjc
Are you considering baking due to moisture exposure? Not all OSPs are created equal. I would check with your PWB fabricator about dry times and effects on their OSP finish. After you get it, I'd still try just one PWB for bake-dry out and check solde
Electronics Forum | Thu Sep 22 07:13:34 EDT 2005 | davef
You need to account for the time and exposure of each MSD component during your production processes. * Barcodes * Software * Procedures * Training * Etc Francois Monettet [fmonette at cogiscan.com ] at Cogniscan [ cogiscan.com ] is a frequent contr
Electronics Forum | Mon Feb 09 09:45:16 EST 2015 | saoasasd
Thanks for the support Jax. Our current scenario: Baking - Not allowed for PCBs Washing - Not allowed Heat Cycles - 2 (Bottom and top side). It's a notebook board Our concern is related to solderability because OSP finishing will be seriously imp
