Industry News: tried (Page 5 of 35)

Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC

Industry News | 2011-05-03 22:50:52.0

Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.

Association Connecting Electronics Industries (IPC)

IPC TECHNOLOGY TRENDS STUDY REVEALS CHANGES IN STORE FOR PCB FABRICATORS AND SUPPLIERS

Industry News | 2012-04-27 19:20:10.0

PCB Technology Trends 2011, a new study published this week by IPC — Association Connecting Electronics Industries®, shows how the demands of miniaturization and high-speed technology are driving changes in printed circuit board (PCB) processes and materials.

Association Connecting Electronics Industries (IPC)

New IPC Solder Manufacturing Council Formed

Industry News |

Association Connecting Electronics Industries (IPC)

2002-03-04 07:32:43.0

Don't Miss KYZEN’s QFN Design Considerations to Improve Cleaning during SMTAI

Industry News | 2014-09-19 20:19:38.0

KYZEN is pleased to announce that Dr. Mike Bixenman will present the paper titled “QFN Design Considerations to Improve Cleaning – A Follow on Study” at the upcoming SMTA International exhibition.

KYZEN Corporation

Industry Mourns the Death of Sean McShefferty

Industry News | 2008-10-16 20:32:34.0

Kyzen (Nashville, TN), October 15, 2008

KYZEN Corporation

Essemtec Introduces CDS6200 with Two Jet Dispenser Systems

Industry News | 2009-03-06 00:18:11.0

Essemtec, the leading manufacturer of SMT production machines, introduces the CDS6200 with two Jet dispensers. The jet-dispensing technology allows proportioning of various media at a large number of points. Because the materials to be dispensed have various specific characteristics, which partially depend on environmental conditions, selecting valves that are suitable for particular materials are necessary. CDS6200 with two Jet dispensers provides the technology to do this.

ESSEMTEC AG

IPC Invited to Participate in Pilot Evaluation of OECD Conflict Minerals Due Diligence Guide

Industry News | 2011-09-06 13:07:52.0

IPC and six IPC-member companies have agreed to participate in a pilot evaluation program to review and refine the Organization for Economic Cooperation and Development (OECD) due diligence guidance for conflict minerals.

Association Connecting Electronics Industries (IPC)

SMTA China Successfully Hosted SMTA China West Conference 2012

Industry News | 2012-06-05 14:09:17.0

SMTA China announces that it successfully organized the SMTA China West Conference 2012.

Surface Mount Technology Association (SMTA)

KYZEN Awarded for AQUANOX A4625 at SMTAI

Industry News | 2018-10-17 18:57:54.0

KYZEN announces that it was awarded a 2018 Global Technology Award in the category of Cleaning Materials for its AQUANOX® A4625 Aqueous Cleaning Solution. The award was presented to the company during a Tuesday, Oct. 16, 2018 ceremony that took place during SMTA International.

KYZEN Corporation

IPC Commends US EPA Proposal to Reduce Reporting Burden on Byproducts Sent for Recycling; Seeks Clarifications in Final TSCA CDR Rule

Industry News | 2019-06-26 20:10:05.0

The electronics industry supports many of the U.S. EPA’s proposed changes to the Toxic Substances Control Act (TSCA) Chemical Data Reporting (CDR) requirements and will continue to work with the agency to protect human health and the environment while streamlining reporting requirements.

Association Connecting Electronics Industries (IPC)


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