Electronics Forum: two passes (Page 5 of 22)

What caused this reflow issue?

Electronics Forum | Wed Apr 16 09:25:55 EDT 2008 | hussman

Do you specify copper weight on your boards? This could be the difference between the the boards. Also the finish will be different between the boards as well. These two factors are enough to cause bottom side parts to reflow and fall off. In eit

GemLine ED ver.3.13 Please Help !!!!!!!!

Electronics Forum | Wed Jul 07 03:23:39 EDT 2010 | propox

Hi, I have two Philips Assembleon lines and hard drive form computes was broken, I am looking GemLine ED ver.3.13. Assembleon told me that the software you are asking for is obsolete and not available anymore. The machines have passed the status of

SMEMA Conveyor into Reflow Oven? How to handle end of line signal.

Electronics Forum | Tue Dec 29 11:38:40 EST 2015 | g2garyg2

Hi Tom If the DYNAPACE has SMEMA out all you need to do is place a two wire jumper into pins 3&4 or 1&2 depending upon DYNAPACE's SMEMA configuration. This will by-pass a Release signal and feed PCBs into the oven.

Chip Component Stacking

Electronics Forum | Tue May 02 16:37:16 EDT 2017 | travishemen

Our customer wanted us to stack two chips but I convinced them to let us place them side by side on the same pads. It had the same effect. They were 0603 size components and the pads were big enough that they still passed IPC for solder quality. I

Homeplates..??

Electronics Forum | Mon May 03 11:26:53 EDT 1999 | Dave F

John: Homeplate is a reference from that American version of cricket ... baseball. In baseball, the pitcher throws the ball towards the batter and the ball must pass over homeplate to be considered to be strike. The ball also must be between the b

AIR TIME

Electronics Forum | Wed Aug 08 10:25:17 EDT 2012 | markhoch

Hi SWAG, Quick question... What type of equipment are you using? We're having constant issues with our Air System. Dryer has had to be rebuilt two times already this year, two air compressors, and both have needed major repairs this year as well. Th

Re: BGA repair/rework

Electronics Forum | Sat Mar 06 12:33:21 EST 1999 | Dean

I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. Concerning the BGA stuff, I'm getting about 60% success using

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 16:06:32 EST 2000 | eLDON sANDERS

Gentlemen, I too have been atacked by that "soldering to gold" and will add my 2 cents. I also had parts that would pop off the board when the fillet looked perfect. After lots of pain, experimentation, and sleepless nights, I solved it through a

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 16:06:32 EST 2000 | eLDON sANDERS

Gentlemen, I too have been atacked by that "soldering to gold" and will add my 2 cents. I also had parts that would pop off the board when the fillet looked perfect. After lots of pain, experimentation, and sleepless nights, I solved it through a

Re: lid soldering problems (CQFP, Au/Sn solder)

Electronics Forum | Tue Sep 22 10:52:31 EDT 1998 | Wayne Bracy

We have problems with voids when we solder lids to ceramic flatpackages. The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel The solder is attached to the lid (preform) and the solder material


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