Electronics Forum: type 4 (Page 5 of 96)

0201 Aperture design

Electronics Forum | Fri Oct 04 01:18:27 EDT 2002 | sarge

1.5. Width >= 4-5 Particle Diameters. Use the smallest opening to determine this. Using dimension of the smallest aperture width, you should be able to fit minimum of 4-5 solder balls side by side into the opening. For 0201 design, -400 mesh (type

Need Help for CCGA Rework

Electronics Forum | Thu Nov 10 21:49:51 EST 2005 | KEN

Why type 4 solder?

regarding leaded profile

Electronics Forum | Tue Apr 24 02:04:09 EDT 2007 | thulasiraman

please send me a indium type 4 solder paste leaded profile

The best solder paste height with screen priting on 6mil stencil

Electronics Forum | Thu Sep 08 03:40:59 EDT 2005 | GS

do not forget also wich Type of paste used( granulometry) if Type-3 ? Type 4? etc, it could change in final metal on your pads/joints. Regards GS

Fighting solder beads

Electronics Forum | Thu Mar 23 06:38:30 EST 2006 | pavel_murtishev

Good afternoon, We can use type-3 solder paste, but what for? Type-3 solder particles are larger than type-4. Probably this will cause even worse release. BR, Pavel

SMT process Blowhole/ Pinhole

Electronics Forum | Wed Apr 09 09:44:12 EDT 2003 | iman

yes, we r profiling direct thermocouple attachment to the LGA pads. based on direct experience of yourself or others, what paste (brand/type3?/type4?/alloy?/flux%?) gives the optimal repeatable characteristic-patterns to minimize this defect?

Stencil and paste used for .4mm pitch csp component ball size .3mm?

Electronics Forum | Thu Aug 30 13:06:10 EDT 2018 | emeto

I don't know your board, but for this specific part: 10mil round aperture on a 3.5mil stencil with type 4 paste wold be ideal

Problems with .45 mil ball diameter BGA....

Electronics Forum | Wed Apr 27 12:26:49 EDT 2005 | jdumont

Square you say? Wouldnt this give less paste deposition than a circle and basically reduce the standoff height the same as making the pad bigger? Would using a type 4 paste for this size stencil aperture (.013") be a good idea? Thanks JD

Problems with .45 mil ball diameter BGA....

Electronics Forum | Wed Apr 27 13:50:01 EDT 2005 | russ

You will want the square in this case to be .013" with rounded corners (slight overprint). I do not see why you would need a type 4 paste for this. the aperture as it sits should release well but obviously there is something wrong.

Problems with .45 mil ball diameter BGA....

Electronics Forum | Fri Apr 29 07:09:10 EDT 2005 | jdumont

Really you think the 256 is the issue eh? I have some a sample of the type 4 powder size coming in hopefully today. Hopefully that will help, if not its back to the old solder eval drawing board. I love my job...


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