Electronics Forum: under stencil wipe (Page 5 of 64)

Re: Ultrasonic stencil cleaner

Electronics Forum | Mon Apr 13 19:35:11 EDT 1998 | Mike Konrad

Aqueous Technologies manufacturers a "no-frills" stencil cleaning system. The Model designed to handle stencils up to 24" x 24" is available for under $ 10K. This system is, however, not ultrasonic, rather spray-in-air. If you desire information, c

mirco bga stencil opening

Electronics Forum | Thu Sep 12 09:15:29 EDT 2002 | mhoughton

I have printed and placed similar devices in high volume with exactly this spec for a couple of years with no problems, are you using laser cut stencils and what type of solder paste are you using? and what is the end use of the product as it may nee

0603 - stencil thickness

Electronics Forum | Thu Jan 09 10:58:30 EST 2003 | soupatech

Thanks for the input.... I ordered a 5 mil stencil AND used more tooling under the board. This gave me a much smaller deposit of solder. I wouldn't swear that was my problem but 96 boards later the problem is 99% gone. I believe there was just too mu

Inspecting a new stencil

Electronics Forum | Fri Feb 15 07:19:22 EST 2008 | floydf

Currently when we get a new screen, we inspect it by holding a pcb or artwork under it and confirming that there are pads underneath all of the holes. The flaw with this approach is that if there are pads on the board with no corresponding hole in th

Re: stencil epoxy debonding

Electronics Forum | Fri Apr 28 21:33:01 EDT 2000 | JP

I had a similar problem. We wold begin to notice the debonding within hours after recieving the stencils. As it turned out, our stencil vendor, located in CA, was shipping the stencil to our facility, located in ND, before the epoxy was fully cured

Nordic aQFN73 stencil design

Electronics Forum | Mon Apr 09 13:53:45 EDT 2018 | dleeper

I've never placed one of these before, but it looks like a poorly designed part. It has pads scattered asymmetrically around the body of the part. when it reflows this is going to apply uneven forces to the component, causing it to skew. I guess hav

mirco bga stencil opening

Electronics Forum | Thu Sep 12 11:26:11 EDT 2002 | scottefiske

CK, If joints have been validated prior to ICT (under BGA Scope), more often than not repeatable joint fractures are due to undo stress being placed on the component during ICT test. Verify ICT probes and fixture. If after proving out fixture/pin com

Nordic aQFN73 stencil design

Electronics Forum | Mon Apr 09 12:52:00 EDT 2018 | slthomas

We are about to do a second iteration of something we struggled mightily with last time and I'm hoping to at least make a step in the right direction. There are 12 of these parts on the board and virtually all of them required removal and replacemen

Solvent for a stencil printer

Electronics Forum | Sun Feb 15 17:32:08 EST 2004 | brian bennett

i have always found any of the alcohol based solvents good.here in the uk we use the alpha make.with screen auto wipes i found the set up to be most important.i.e how many pcb's printed before wiping.i found running pcbs with bga and .50 pitch compo

Solvent for a stencil printer

Electronics Forum | Mon Feb 16 16:37:40 EST 2004 | adlsmt

I would try it dry first, we have never used solvents in our SPM, AP-20 or UP2000. Wipe every 4 to 10 boards. Normally dont have to wipe when using epxoy.


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