Electronics Forum | Mon May 18 08:59:41 EDT 2009 | ozgurv
Dear All, Does anyone on the forum have experience with underfilling process of bga? We have a component with 0.5mm bga on one of the new products. Customer wants this component to have an underfill. Questions - 1) which kind of epoxy or chemica
Electronics Forum | Mon Mar 29 13:33:05 EST 2004 | Ron W
I was wondering if anyone has attempted to develop a process for the successful removal of a BGA and its underfill. Or, is it the general industry thought process that an underfilled BGA cannot be reworked.
Electronics Forum | Tue Apr 27 15:09:48 EDT 2004 | zymet
Hello Ron, Successful removal of an underfilled BGA requires the use of a reworkable underfill, which Zymet manufactures. For more information on such products, send an inquiry to info@zymet.com. Regards, Carol
Electronics Forum | Thu Sep 09 10:50:59 EDT 2004 | agkettle
Does anyone have any experience with underfill of HD connectors? New customer wishes to underfill 6 HD connectors that have been pressed into PCB. Capillary action is causing the conformal coat to wick up into connector. Material is acrylic.
Electronics Forum | Wed Jun 07 07:53:24 EDT 2006 | RLM
This is true but even the so called reworkable underfill takes a lot of effort. We use a loctite reworkable that requires heat to soften the underfill. Once the component is removed we use acetone and a swab to scrub the pcb clean. This can be very t
Electronics Forum | Fri May 02 11:36:21 EDT 2008 | fsw
I am of the same opinion! I don't think customer has clear idea of the underfill requirement. From our talks with them, it seems they feel that since the build is RoHS compliant, they feel more comfortable having an underfill on that component to cov
Electronics Forum | Tue May 19 06:57:33 EDT 2009 | cunningham
whats the reason for the underfill? we dont underfill any of our BGAs rework could be a issue if they need to be replaced? tried DP190?
Electronics Forum | Wed Jul 01 18:49:27 EDT 2009 | stevenlimth
1smtdude, I interested in your explaination of re-work an underfill part. You mention the material can be heated to a plastic state to become vicious... do you know usually what range is the temperate? (guess it can depend on the type/manufacturer o
Electronics Forum | Tue Feb 21 10:58:02 EST 2012 | ppcbs
Can anyone suggest a good underfill compound that is readily available for manual dispensing. I need to underfill a small BGA less that 12mm square.
Electronics Forum | Fri Mar 28 10:21:16 EDT 2014 | davef
With heat, most underfills soften just before the solder melts. So, keep poking the underfill until you see it soften. Then, wait just the correct amount of time until the solder melts and quickly snap or torque the part from the board. BR davef
