Used SMT Equipment | Pick and Place/Feeders
Samsung SM411 parameters To the way the flight vision Number of Spindles 6 Spindles x 2 Gantry Mounting Speed Flying Vision Chip 1608 SOP 42,000 CPH (IPC9850) 30,000 CPH (IPC9850) Mounting accuracy Chip ± 50 μ @ 3σ / Chip (Base
Used SMT Equipment | Pick and Place/Feeders
Specifications *High speed placement at 0.165 sec / comp ( 21,800 cph) *On the fly vision *Fuji’s proprietary Multi-step (MS) vision processing Algorithm *Auto calibration *PCB Dimensions: Max: 508mm x 457mm Min: 80mm x 50mm Thickness
Used SMT Equipment | Pick and Place/Feeders
Chip theoretical speed of 21,000CPH Mounting range 0402mm Chip to 55mm Placement accuracy plus or minus 0.03mm PCB size 460 * 400 * 4.2 ~ 50 * 40 * 0.38 Equipment size L1,650 * D1,680 * H1,530 Power 4.7KVA Equipment weight 1800kg Samsung SM
Used SMT Equipment | AOI / Automated Optical Inspection
BF-Frontier is used in the inspection of large-size printed circuit boards. In this device, the unique control sequence of software and hardware, accelerated scanning mode and stable optical illumination system can allow BF-Frontier to easily complet
Used SMT Equipment | Pick and Place/Feeders
Samsung Pick And Place Machine Decan Series Decan S1 Model DECAN S1 Alignment Fly Camera + Fix Camera The number of spindles 10 spindles x 1 Gantry Placement Speed 47,000 CPH (Optimum) Placement Accuracy ±28μm @ Cpk≥ 1.0 Component Ran
Used SMT Equipment | Pick and Place/Feeders
Description MODEL ID: CM402-L MODEL NUMBER: KXF-4Z4C PCB DIMENSIONS: L 50 mm x W 50mm to L 510 mm Ã? W 460 mm HEAD TYPE: Type A-2 (12/12 nozzles HIGH-SPEED) (OPTION) Number of nozzles: 12 nozzles/head Maximum speed: 0.052 s/chip (69,500
Used SMT Equipment | Adhesive Dispensers
YAMAHA placement machine YV100X type substrate size: 1, M-Type: L460 * W335 ~ L50xW50mm / t = 0.4 ~ 3.0mm 2, L-Type: L460 * W440 ~ L50xW50mm / t = 0.4 ~ 3.0mm 3, ※ATS20A use: L460*W250~L50xW50mm Second, YAMAHA placement machine YV100X productio
Used SMT Equipment | Pick and Place/Feeders
Board size (without buffer function) minimum L50 x W30mm~maximum L1,480 x W510mm Substrate size (when using inlet and outlet buffer functions) Minimum L50 x W30mm~Maximum L540 x W510mm Substrate thickness 0.4~4.8mm Board conveying direction: left&
Used SMT Equipment | Pick and Place/Feeders
Device Name: Samsung SM411, Samsung SM411 Mater, Second-hand Samsung SM411 Mater Equipment Profile: The SM411 uses the Samsung Patent On The Fly identification method and the double cantilever structure to achieve the chip component 42,000 CPH and
Used SMT Equipment | Pick and Place/Feeders
Board size L50 x W50mm to L460 (Max. L1200 OP) x W410mm Board thickness 0.5 to 2.0mm &nb