Electronics Forum | Tue Feb 10 20:40:49 EST 2004 | Kevin McCarten
1st thing to be said; I work for a company that supplies Desiccant Dry cabinets to the electronics industry for the storage of moisture sensitive components. The answer here really lies in inventory management/control. Ultimately you want to avoid b
Electronics Forum | Mon Jul 30 12:41:47 EDT 2001 | hinerman
1. Realizing not all PCBs will be warped, but for those that are, the tooling can be set when the board is in contact with the stencil, which will take out some warp. On an MPM, the vacuum box helps to hold the board flat If the warp is more sever
Electronics Forum | Fri Jun 18 10:59:37 EDT 1999 | Scott Cook
| A user of one of our components exceeded the floor life of some plastic BGA components. They did do a pre-bake prior to SMT reflow but only 72 hrs at 40C and not the recommended 12 hours at 125C. I've recommended accoustic microscopy to look for po
Electronics Forum | Tue May 30 13:50:40 EDT 2006 | Dragan
Hi, I ran into a problem and need a solution. It is a 3cm*4cm*1mm 2 layer PCB (6x6 panel) with a LQFP128 package Microcontroller, a resonator and 2 capacitors. What happens is: When i recieve the assembled pcbs from the assembly plant they wor
Electronics Forum | Tue May 30 17:17:08 EDT 2006 | Dragan
Hi, I ran into a problem and need a solution. It is a 3cm*4cm*1mm 2 layer PCB (6x6 panel) with a LQFP128 package Microcontroller, a resonator and 2 capacitors. What happens is: When i recieve the assembled pcbs from the assembly plant they wor
Electronics Forum | Fri Mar 19 03:13:35 EDT 2010 | mun4o
Hi, First check what the Moisture Sensitivity > Level of the LEDS is....you may need to ask the > LED manufacturer. Once you've established it is > moisture sensitive then follow latest version of > IPC JEDEC 33 spec. for storage of them and dryi
Electronics Forum | Wed Aug 28 10:16:12 EDT 2002 | Jim M.
Sam We install a lot of die in the SMT room using same process as SMT parts.Water soluble solder paste is used for attachment of die to ceramic and boards. Biggest problem i found is the adjustment from installing the die in the bonding area. The t
Electronics Forum | Tue Sep 22 10:52:31 EDT 1998 | Wayne Bracy
| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material
Electronics Forum | Tue Apr 13 14:49:15 EDT 2010 | davef
90%) from the sample, and the bake time and temperature specified herein are minimums. To improve test accuracy, or to prevent heat damage, other bake parameters may be AABUS. 2 Applicable Documents IPC-QL-653 Certification of Facilities that Inspect
Electronics Forum | Fri Aug 13 08:14:38 EDT 1999 | Peter Barton
| Ladies and Gentlemen, | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav tremendous
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