Electronics Forum | Tue Oct 20 03:22:52 EDT 1998 | Viswanath Valluri
Hello : Some of the recent FBGA (a Chip Scale Package) packages that I am looking into have body sizes having aspect ratio's 2:1. In particular, body sizes of 14x8mm, 15x8 mm etc. The ball count for this particular package is around 40-68 I/Os. My qu
Electronics Forum | Mon Nov 20 21:02:46 EST 2000 | Michael Psrker
First question I have for you is: Are you assuming that standard precautions are in place at your facility to minimize moisture content i.e. air- deionizers, vacuum sealed packaging, humidity control in storage and manufacturing? You do not mention
Electronics Forum | Tue May 19 02:59:46 EDT 1998 | P.L. Sorenson - Technical Consultant
| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |
Electronics Forum | Wed Jun 23 11:02:09 EDT 1999 | John Thorup
| | We are reflowing boards that have glop top components | mounted on them. Do glop tops have the same moisture | sensitivity as fine pitch? Should we be baking the boards | prior to reflow? | |If your glob tops are PBGAs, they are likely very mo
Electronics Forum | Fri May 03 10:51:24 EDT 2002 | fmonette
Dave is correct. I am including additional information that comes from a recent posting on another industry forum : The proper guidelines for bag sealing are actually specified in the JEDEC standard EIA/JEP124 section 5.2.1 Packing moisture-sensiti
Electronics Forum | Sat Sep 25 09:18:40 EDT 1999 | Steve E ( Fuji America )
| Question for you SMT guru's out there. | | What is the best way to support boards on Fuji's CP6 machine's x-y table...particularly for 2nd side SMT where the support side already has parts... I am toying around with the following methods: | | 1.
Electronics Forum | Tue Aug 19 12:15:37 EDT 2003 | D Peter
Again, that is for packaging, rather than moisture removal or storage. Those guidlines are for several reasons, preventing low pressure outgassing or disassociation of the dessicants, damage to parts or wafer tray due to forces on the evacuated pack
Electronics Forum | Tue Jun 27 17:26:03 EDT 2000 | John Thorup
Hello Christopher You should do just fine without vacuum evacuation of the bag. Just squeeze out any excess air. Just be sure that you use active desiccant (I.E. fresh or baked). This assumes normal environmentals. I suggest that you download the
Electronics Forum | Wed Nov 11 22:13:45 EST 2015 | jackzhong
Hi, if you seal in proper way, it is not necessarily to vacuum. we are specialized in moisture solution for electronics and components. Maybe we could give you some workable advice or solutions. If you are interested, contact me by Skype:dryplus1 o
Electronics Forum | Fri Jan 06 00:03:10 EST 2023 | SMTA-64419298
Hello Evtimov, sorry...just saw post as I was looking through list...a bit late. I don't know if you ever got your answer. IPC-4552A covers EniG finishes and suggested shelf life. I've referred to these doc's quite a bit. Good spec's ! Yes, I beli
