Electronics Forum | Mon Mar 02 23:48:22 EST 2015 | vb7007
Hi We are using Universal carrier for a 2 sided PCB, where the bottom side goes for hand solder the switches after wave. Our issue is, we are getting micro solder balls all over PCB bottom after wave, whereas we got numerous vias, which also turns
Electronics Forum | Tue Dec 04 09:48:43 EST 2001 | davef
Defining the thickness of solder between the lead and the pad, J-001 states "Properly wetted fillet shall be evident." J-001 is available from http://www.ipc.org. Factors that affect this are: * Amount and composition of solder * Amount and compo
Electronics Forum | Tue Mar 03 09:29:48 EST 2015 | rgduval
A couple of things that have helped me with solder ball issues at wave in the past: 1. Flux. Insure good flux coverage on the bottom of the board. 2. Preheat. Insure that the board is sufficiently preheated for the wave operation. Since you're
Electronics Forum | Tue Jun 09 07:35:23 EDT 1998 | Steve Gregory
Hi there Gary, Your solder ball problem is very similar the problem I experienced, but I was using a water soluble paste at the time. It started by inspectors telling me that they were seeing cold solder on some SIMM's that we had built regularly. W
Electronics Forum | Thu Jan 27 11:23:45 EST 2005 | russ
Well first off I wouldn't evaluate paste for a wave process. I would use solder bar instead. Flux - top side fillets and no shorting on the solder side, does it clean well after processing if using water soluble flux. How wide is the process win
Electronics Forum | Fri Apr 27 10:38:30 EDT 2007 | pjc
No dome needed. You should check what type probe you have. You can look here and consult with them: http://www.qualmaxamerica.com/qualmax/leeno/semi.asp?string=ICT
Electronics Forum | Tue Jun 09 15:46:29 EDT 1998 | Aric Parr
| Hi there Gary, | Your solder ball problem is very similar the problem I experienced, but I was using a water soluble paste at the time. It started by inspectors telling me that they were seeing cold solder on some SIMM's that we had built regularly
Electronics Forum | Thu Oct 30 22:29:58 EDT 2008 | davef
For most applications, a nice square [or rectangle] pad works just fine. Assemblers ship boat loads of boards with these every day. It's reasonable for tight decoupling capacitor requirement applications to use round or radiused pads for components
Electronics Forum | Mon Jul 17 16:45:24 EDT 2017 | capse
Sergey, The Assembleon GEM Series machines were built by Yamaha. They currently support them via Trans-Tec, their distributor. At least in Asia and NA, I'm a Yamaha/Trans-Tec Rep in the southeast US. Remember it is buyer beware in the secondary marke
Electronics Forum | Sat May 24 07:21:51 EDT 2003 | davef
Try: * Aries 908.996.6841 * Antona 310.473.8995 * Oztech 510.782.2654fax2656 * Emulation Technology 408.982.0660 800.232.7837 fax 0664 emulation.com * Interconnect Systems (BGA/BGA, BGA/QFP, BGA/PGA) 708 Via Alondra Camarillo CA 93012 805.482.2870 fa
