Electronics Forum | Thu Dec 03 21:40:01 EST 2020 | itmconsulting
Hey Kyle - Good for you for pushing your horizons and considering pin-in-paste (aka "Intrusive Soldering"). Don't let the nay-sayers out there discourage you. When I encounter mixed tech PCBAs (SMT and through-hole) my first choice, if the design a
Electronics Forum | Tue Aug 26 22:56:39 EDT 2008 | omid_juve
we have solderability problem(some pins aren`t soldered) with two devices in our board with the below detail EP1K30QI208-2 brand:ALTERA with the package PQFP-208 TMS320VC5416PGE160 brand:TI with the package TQFP144 these two devices are pb free but t
Electronics Forum | Tue Dec 15 09:26:37 EST 2020 | stivais
Have you tried cutting the leads shorter (or lift the connector slightly) so that they barely protrude at the other side of the PCB? Just for testing purpose, for mass production you should find a connector with shorter leads then. This should help w
Electronics Forum | Thu Dec 17 15:53:32 EST 2020 | dwl
for option 3, if you place the connectors on the first pass then flip the board, won't the protruding leads interfere with second pass stencil printing? My vote would be to overprint onto the solder mask. you can print pretty far and still have it w
Electronics Forum | Sat Jun 12 00:34:00 EDT 2004 | kanwal324
Hi ! The main problem being faced currently is formation of solder balls - to be precise, these are micro solder beads generally found attached with bodies of SOTs, Chip Caps, Chip Resistors, between pins of SOICs (50 mil) - lying on PCB surface,
Electronics Forum | Mon Aug 18 11:20:08 EDT 2008 | pjc
Stencil apertures are cut to deposit solderpaste onto the annular ring, provided its wide enough. Then you can place a solder preform if needed to ensure there is enough solder to fill the barrel. Here is some information on solder preforms: http://
Electronics Forum | Tue Mar 17 13:11:58 EST 1998 | ETS, LLC
ETS (Energy Technology Systems) is a manufacturer of Solder Reflow and Curing Ovens for the Electronics Industry. We offer a specially configured oven designed for processing of Pin in Paste processes as well as double sided mix technology boards. I
Electronics Forum | Thu Apr 29 17:19:59 EDT 1999 | Kevin Hussey
Hi Boys and Girls, I've been given the "task" to turn off the nitrogen in our reflow ovens. I am using the BTU, TRS series ovens, each with eight zones. Also, I have a couple of new BT Paragon ovens with 10 zones. We currently are running Qualite
Electronics Forum | Sat Jan 16 03:06:36 EST 1999 | Wirat S.
| | Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | | | Regard
Electronics Forum | Tue Jan 25 07:49:17 EST 2005 | davef
On "Solder beading seemed to be a problem", consider revisiting the thermal recipe used for reflow. The PTH barrel may not be getting warm enough. On "Component not being designed to pin in paste work, with no proper standoffs", consider: * Using a
