Electronics Forum: wave and component and mov (Page 5 of 8)

TH lead tinning process and solderability

Electronics Forum | Wed Apr 06 08:27:12 EDT 2011 | kaschliman

Our two component suppliers use 99.5Sn/0.5Cu and 97Sn/3Ag solder (respectively) for tinning their leads. We use 98.9Sn/.66Cu/.33Ag solder in our wave solder machine. Is there any significant advantage to either tinning process regarding solderabili

Re: Bottom side smt and thru hole

Electronics Forum | Sun Jun 07 09:43:11 EDT 1998 | Bob Willis

There are some guidlines on design and through hole reflow on my web site to download. Also on pin in hole reflow the SMTA Office has a document on using the tecnology. | R&D is currently designing a board with smt components on both sides of the bo

0201 Land Pattern and Aperture Shape Design

Electronics Forum | Thu Mar 10 09:13:15 EST 2005 | davef

From http://www.IPC.org ... IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components, includ

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef

Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept

Selective soldering pallets and solder balls

Electronics Forum | Mon Dec 16 19:05:57 EST 2002 | davidduke

Steve , I agree with all the responses you have received. Randy Villeneuve is absolutly correct in all of his assesments and I would consider him an expert with the process , Gris is correct about adding a "heat sink" to the process complicating pr

Re: Bottom side smt and thru hole

Electronics Forum | Wed May 27 13:42:08 EDT 1998 | Chrys

| R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommen

No-Clean flux residue and RF application

Electronics Forum | Tue Aug 30 12:08:09 EDT 2005 | slthomas

The answer for us at my previous employer was water soluble flux. Wash the board, no residue. If you're not set up to wash (needing a washer, DI water source, waste treatment, ventilation, etc.) it can be expensive and space consuming. Do some resea

Conductive contamination and the elusive solution

Electronics Forum | Fri Jul 13 16:45:37 EDT 2007 | losersk8er

The Contamination has proven to be pretty random, lots of stainless steel though in fact two cases in the past two days. As far as I know all machinery is cleaned regularly as well, even the stencil washer itself. The boards we make are 90% (at l

Re: WAVE SOLDERING and Gluing 0603 packages

Electronics Forum | Sun Apr 25 12:05:50 EDT 1999 | Chrys Shea

| | | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free solderin

Re: WAVE SOLDERING and Gluing 0603 packages

Electronics Forum | Mon Apr 26 09:18:27 EDT 1999 | C.K.

| | | | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free so


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