Electronics Forum | Mon Aug 11 10:35:32 EDT 2008 | realchunks
What does your top side wetting look like? This is a perfect case where top side wetting will tell you when you have a good joint. Without seeingor knowing your process, I would suggest either more pre-heat or longer dwell in the solder. Either on
Electronics Forum | Mon Aug 03 15:49:31 EDT 2009 | gtemkin
Sounds like the Pin in Paste would be a reflow technique not involving a pot. I'm guessing however the same causes are in play, in that the poorer wetting of the Pb-free allow means it drops out of the joint before it can wet to the terminal. We us
Electronics Forum | Mon Nov 10 08:53:23 EST 2014 | jpal
We have the opportunity to buy a new selective solder machine and are used to using a very old Jade machine with a moving tank and wetted nozzle. I have two process concept questions: Which is better- move the board over the nozzle or move the nozz
Electronics Forum | Fri Aug 04 06:43:40 EDT 2017 | kubabel
Dear all, I´d like to ask You, if somebody faced similar situation like we are facing in our plant right now. We have wetting problems with some of our products. During SEM/EDX we found on non-wetted parts residues of Mineral oil - white - heavy. Do
Electronics Forum | Thu Nov 14 10:18:31 EST 2019 | slthomas
It doesn't look to me like the jumper wire is wetting at all. I would immediately question the solderability - do you know how that jumper wire is finished (plating type)? Also, how experienced are the solderers? It could be that the wire never get
Electronics Forum | Thu Aug 24 13:20:24 EDT 2000 | Murad Kurwa
One of our divisions is having this problem: - De-wetting on the smt pads and componenent termination on the bottom side after top side procssed through reflow. Board finish is immersion silver. ? Any recommendation on what we should check & verify
Electronics Forum | Fri Sep 14 02:18:32 EDT 2001 | gsparka
Hi. After reflow soldering. There are lots of non wetting of leads. 71 b'd all are mounted resister,condensor,qfp,plcc,bga have got the defects so many. all defecs occured in the fine pitch ic. others are good. On some fine pitch pads not mou
Electronics Forum | Thu May 16 22:37:22 EDT 2002 | xzinxzin
anyone experience to solve the non-wetting on Microleadframe packages component terminal sides. 1)I test the components solderbility in dip and look test, in solder pot at 240 deg C,the wetting on the sides is ok. but I run on mass production in refl
Electronics Forum | Wed Jan 11 08:27:35 EST 2006 | davef
MSK As GS told you in an earlier posting, J-STD-002 and IEC 68-2-69 describe methods and equipment for component solderability testing. Go get a copy of either one. The primary component solderability test methods are: * Dip and look method * Wett
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