Electronics Forum | Wed Mar 12 23:00:10 EDT 2008 | davef
You can say: The pad was lifted after reflow and prior to the dye and pry failure analysis. When we see lifted pads, we think: * That's a good solder connection * Either it took a lot of force to lift that pad or the fabrication of the board in the
Electronics Forum | Tue Jan 31 12:37:33 EST 2006 | carterhoward
I guess my biggest concern would be what will happen to the inner metallic layer of the leaded solder during the higher temperatures.
Electronics Forum | Tue Jun 01 17:37:34 EDT 2004 | lynnmc
Any view on what the minimum reflow temperature is for a SAC ball bga to form a reliable joint with PbSn solder?
Electronics Forum | Tue Feb 25 17:41:29 EST 2020 | emeto
What we did not talk about is Mycronic machine. Great choice for small batches.
Electronics Forum | Tue Oct 05 12:46:02 EDT 2021 | emeto
From what I understand SAC305 and SAC405 are considered low silver content and have the better overall mechanical qualities compared to more silver or no silver.
Electronics Forum | Wed Feb 16 21:26:11 EST 2005 | Mrduckmann2000
Well, I have not had a chance to run my experiment yet. I hope to have the wave solder machine to myself on Friday morning. I will let you know. I am hopefull from what you and the others have said that it will work and we can reduce our touch lab
Electronics Forum | Tue Aug 12 14:49:26 EDT 2008 | awegener
I'm attempting to pick and place a small rivet onto our PCB. The rivet should be attached via reflow solder. The rivet will be used to create a sandwich, holding together a frame and additional circuit board in a package. This part is intended onl
Electronics Forum | Thu Oct 01 13:33:01 EDT 2015 | marlyn
Hey there fellow people with SMT > issues... What's the proper procedure for > soldering through-hole headers on the back-side > of the PCB (pins poking out on same side as SMT > parts)? ( Yes - I did the SMT side first and am > now faced with L
Electronics Forum | Mon Dec 18 23:24:50 EST 2006 | grantp
Hi, Yes, I would hate to resort to cleaning, but the product must be clean. We have been using palettes to keep most of the flux off the PCB, but there is still residue around the connectors. Does anyone suggest a good no clean flux to use with le
Electronics Forum | Tue May 02 15:29:14 EDT 2000 | M. F. Roe
I am looking for public papers or articles on intermetallic formation as a function of reflow profile. Most solder paste vendors specify peak temperature and time above liquidus, but I am particularly interested in what happens to intermetallic grow
