Electronics Forum | Fri Aug 17 11:55:31 EDT 2001 | davef
5uin. Your nickel thickness is fine. Although if you wanted to trade costs, consider giving-up nickel to 150uin thickness, while increasing the gold thickness. Gold over electroless nickel creates brittle joints because of phosphorous in the nicke
Electronics Forum | Tue Aug 21 22:24:36 EDT 2001 | davef
Root around here http://www.kns.com/resources/library/lib-wirebonding.asp
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
Electronics Forum | Tue Jul 18 16:49:49 EDT 2023 | mahasg
Hello All, I am PhD student at polytechnique Montreal. We have a CQFP44 packages and Dies of 51um pad pitch (22nm FDSOI tech) that I need to bond myself at the university using ASM Eagle Xtreme gold wire bonder in the university. we need to perform b
Electronics Forum | Wed Dec 14 12:34:56 EST 2016 | cy4223111
Hi all, Recently, we are trying to do wire bonding between a 75 * 75 um pad on a chip and substrate with 150 um height difference, but when completing wire bonding and the wire bonds on pad and substrate, the pad will get out of the chip easily
Electronics Forum | Wed Mar 25 09:01:09 EST 1998 | Harvey Grossman
What is the recommended finish for wire bonding ? Type of AU, thickness, etc. thanx...
Electronics Forum | Sat Jan 21 12:18:53 EST 2006 | theSaint
What is wire bonding? What are the applications?
Electronics Forum | Wed May 18 07:22:06 EDT 2005 | davef
Wire bonds don't stick when bonded * Check pull and shear strength. * Depending on point of failure, review parameters. * Listen during bonding, if there is a high pitch buzz, there is vibration in the system somewhere, "seek and destroy". * Get the
Electronics Forum | Wed Mar 29 18:17:16 EST 2000 | David
Does anybody out there have experience building electronics assemblies with DCA (Direct Chip Attach - bare die onto PCB) and wire bonding? - What Die Bonder/Dispensing Machines are recommended? - What brand conductive epoxy were used to attach die?
Electronics Forum | Fri Dec 16 13:37:52 EST 2016 | edhare
Hi all, > > Recently, we are trying to do > wire bonding between a 75 * 75 um pad on a chip > and substrate with 150 um height difference, but > when completing wire bonding and the wire bonds > on pad and substrate, the pad will get out of
