Electronics Forum | Wed Apr 22 08:08:10 EDT 2009 | c111
Thanks! We would outsource as we do not have the man power for this effort
Electronics Forum | Fri Jun 21 13:05:58 EDT 2002 | surinder
Hi Stephan, Thanks,Yes there are thieving pads on Ic's .Also the two QFP, which mention,that will be removed by modifying the design in long run ,if the results/Yields are okay as with Glue as Compared to solderpaste process. Yes you are right here,b
Electronics Forum | Fri Oct 22 04:09:22 EDT 2004 | christina
Is there anyone who knows the yield rate difference for SMT on multi-flex boards and rig-flex boards ? Basically, I think the yield rate should be higher for rig-flex than multi-flex due to the poor dimensional stability of polyimide, since multi-fle
Electronics Forum | Mon Aug 07 09:58:41 EDT 2006 | nodlac
Davef's link is a great one. Mine pales but may be helpful... - This one is from Georgia Tech on Yield... http://www.cbar.gatech.edu/about/publications/Analysis%20of%20Factors%20that%20Affect%20Yield%20in%20SMT%20Assembly.pdf - http://www.cbar.marc
Electronics Forum | Fri Nov 17 14:55:27 EST 2006 | CK the Flip
Typical of QE types. They don't know the entire process of qualifying what makes a "good" board (besides FPY), so they just arbitrarily come up with 95% FPY as a benchmark. Russ made a great point that alot of yield issues are design-related. Typi
Electronics Forum | Tue Jan 02 17:39:45 EST 2007 | fastek
Personally I wouldn't care what the industry standard is....if I was producing something where 15 out of 100 failed, it would not be acceptable. Determine why this is happening and fix the problem and don't be concerned with what anyone/everyone el
Electronics Forum | Mon Jul 09 11:59:25 EDT 2007 | sck1971
Does anyone have any industry standard yield factors to load at the component level to account for set up scrap and machine waste during production? I'm assuming there are different percentages used for each package size (0402, 0603, SOIC8, etc) but
Electronics Forum | Mon Mar 10 04:15:22 EDT 2008 | grantp
Hi, We have had a few vendors push automatic solder paste inspection devices on us in the past, and I have resisted until now. However we have a new product with a micro BGA on it, and I am worried about yield, so am considering it seriously for th
Electronics Forum | Thu Nov 13 10:33:08 EST 2008 | evtimov
Hello everyone, can you tell me hoe you define your first pass yield? In my company it seems that it goes wrong: 1. smt 2. Repair 3. Wave 4. Test(some repairs) 5. FPY Somehow it looks wrong to me. Should it be separately for all processes or it sh
Electronics Forum | Tue Oct 28 18:58:05 EDT 2014 | rangarajd
You might want to consider using a stepped stencil. We have tried using a 5 mils with an increased aperture size to compensate for the lost solder volume, if you were to use a 6 mils. While the yield was good, we'd still get random opens. With a 6 m
