Electronics Forum | Fri Nov 12 16:27:43 EST 1999 | Michael Allen
The papers I've read suggest that we need to be concerned if the weight percent of gold in the finished joint exceeds 3%. You might want to do the calculations to see where you stand, before you set up a process to "tin" the leads. If you find that
Electronics Forum | Thu Nov 11 14:55:23 EST 1999 | Dave F
Dave: I think you�re correct. The solder balls are probably from either: � Excessive paste � OR � Paste "exploding/popping" during reflow � OR � Some other variable. Two things: 1 It�s virtually impossible to determine the cause of your ball gen
Electronics Forum | Mon Nov 15 12:13:41 EST 1999 | Dave F
Steve: There are guidelines for determining if your aperture has the correct proportions to the foil thickness. Maybe that�s what you�re looking for: 1 Aspect ratio = aperture width/foil thickness Chemically etched SB GT 1.5 Laser cut SB GT 1.2
Electronics Forum | Thu Oct 28 18:14:51 EDT 1999 | John Thorup
Try looking for paste contamination somewhere. Dirty stencil, printer table or fixtures. Placement table/fixtures. Reflow belt/conveyer. Reuseable finger covers, if used. Try covering the fingers with Kapton tape during different stages of the proc
Electronics Forum | Thu Oct 28 12:02:13 EDT 1999 | John Thorup
Automation and low cost is an oxymoron sort of like jumbo shrimp. Automation will set you back $20,000-100,000. Optical comparitors aren't cheap either. Low cost means good eyeballs, a "golden" sample board and up-to-date documentation. Also low c
Electronics Forum | Thu Oct 21 11:32:15 EDT 1999 | John Thorup
Larry Elaborating on the specific question, yes, the volatile solvents in the flux can and will evaporate. Evaporate completely in any reasonable amount of time? Probably not. What tends to happen is that the exposed paste dries on the surface and
Electronics Forum | Tue Sep 21 12:50:08 EDT 1999 | Hugh Martin
| | I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | | | Thank you. | | | Just for
Electronics Forum | Sat Sep 25 01:42:52 EDT 1999 | john
| I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | Thank you. | don't try overlays o
Electronics Forum | Fri Sep 17 15:20:52 EDT 1999 | Earl Moon
| HI everyone, | | We are using a Siemens ap-25 screen printer, in the past we have not had any problems with adhesive placement until a couple of weeks ago. It seems the x axis has decided that it should be set somewhere between .00085 and .001
Electronics Forum | Wed Sep 15 12:02:19 EDT 1999 | Jim Trent
| Does anyone know the best way to program my Camelot glue dispenser off line? I really like the machine, it just takes me too long to program it. We do contract work so I can get gerber data for all (most) of my assemblies. I need to get these pro