Electronics Forum | Tue Jun 27 17:26:03 EDT 2000 | John Thorup
Hello Christopher You should do just fine without vacuum evacuation of the bag. Just squeeze out any excess air. Just be sure that you use active desiccant (I.E. fresh or baked). This assumes normal environmentals. I suggest that you download the
Electronics Forum | Tue May 23 20:37:22 EDT 2000 | Dave F
Gabby: Trying to avoid accusations of plowing new ground eh? Inert soldering: R Curthers et al, "Optimizing A No-Clean Circuit Board Process Using Nitrogen Inerting In A Conventional Wave Solder Machine," NEPCON West 1991 T Walsh, "The benefits Of
Electronics Forum | Tue Mar 13 14:17:00 EST 2001 | blair
Thanks a lot for the response 1) there are 8 BGA on this board 6 PBGA, 1 TBGA and 1 ESBGA (metal lid). They are dispersed over the board (approx 11"* 14") 2) Is there a tool to use to understand pitch/bump size and stencil aperture (optimized)? 3) Y
Electronics Forum | Tue Mar 13 17:26:07 EST 2001 | blair
1) We could press on BGAs and the boards would boot 2) This is basic boot up yield 3) We are now getting stpe by step inspection data going fwd. 4) So, Stencil design could be a critical factor. Any documented guidelines? 5) Yes DFX was done - mostl
Electronics Forum | Wed Mar 21 16:32:03 EST 2001 | mparker
The root cause is dependant on the type of solder "splash", ball, whatever, that you are seeing post reflow. If it is smears, then cleaning the stencil underside is probably the answer. Are you using automatic wipers? How many print cycles between w
Electronics Forum | Mon Oct 08 21:05:00 EDT 2001 | ksfacinelli
DO NOT Mix Technologies.... If you are using a no clean solder paste use a no clean wave solder process. I have direct experience with using a no clean paste and a RA water-soluble wave solder process. When cleaning with the water wash system your
Electronics Forum | Wed Apr 25 16:35:55 EDT 2001 | Steve
Most of the time, we have very few skewed parts so I feel comfortable about the processes in general. However once in a while, often enough to throw off the first pass yield, we will get a few boards with a lot of skewed parts. By skewed I mean that
Electronics Forum | Sat Feb 05 09:01:15 EST 2000 | Dave F
JS: The issue is not how efficiently/effectively that you can run your placement machine, probably. The issue is how efficiently you can run that part of your assembly process that is the bottleneck. Other than improving quality, optimizing any pa
Electronics Forum | Fri Jan 21 09:34:56 EST 2000 | Eric Krone
Throughput is usually measured by how many components are placed over the production day. Making sure it is actually placing parts all available hours of that production day optimizes the placement machines performance. The time the machine is actu
Electronics Forum | Tue Oct 12 15:20:44 EDT 1999 | Jim Schultz
I need your help! We have been doing double sided surface mount for 4 years now. Up until 6 months ago I have not had a tombstoning problem. Since then I have a fairly high incidence rate of tombstones on the 0603 size resistors (no other parts).
