Electronics Forum | Wed Feb 05 21:05:38 EST 2003 | davef
Iman On your situation: As an earlier poster stated, your options are limited to opening you stencil aperture to compensate for the paste lost to the via. On your designer's belief that "it helps in heat dissipation": Could be true, but: * Hole wil
Electronics Forum | Tue Feb 11 16:27:18 EST 2003 | Chad
Currently we hand-assemble all prototypes, usually quantities less than ten. I mentioned the 5 to 50 number because a client will occasionally request more than ten, which has been handled previously by using an outside contract manufacturer (we are
Electronics Forum | Wed Feb 26 15:26:44 EST 2003 | MA/NY DDave
What object am I cleaning 2>What chemicals/deposits am I removing (Chemistry?? 3>What is the process my machine uses. Now if Water Based works than you are OK from a cleaning aspect. The only problem as Mike noted, at least to my reading, is what ca
Electronics Forum | Thu Mar 20 12:04:42 EST 2003 | Ren� Sandoval
Hello Garcia: For my experience in Tombstone problems I recommend you to check the next points: -Use Solder paste with 2% silver -Use 5 mils Th Stencil -In some machines , for 0402 or smaller componentes , you require an special holder for the feed
Electronics Forum | Tue Mar 18 09:11:14 EST 2003 | Rob C
With a standard valve and no-clean solder paste you may get a few good dots. But, repeatability will be terrible too many variable, air-pressure, board height (two post nozzle), valve time on/off, retract height, retract time, etc... A RMA paste wi
Electronics Forum | Mon Apr 07 13:26:25 EDT 2003 | billschreiber
Dear Yukim, You may want to make sure that your presolder cleaning processes will support the change to a new flux. Many chemistries are vertically oriented and will clean only a selected few types of solder pastes. If you find that a new cleaning
Electronics Forum | Tue Apr 01 11:18:47 EST 2003 | cyber_wolf
Is anyone out there successfully screen-printing SMD adhesive on an 0402 layout? We have successfully done 0603 and larger, but the deposition consistency on the 0402's is just not there. We don't always get enough epoxy on the board. We have tried a
Electronics Forum | Wed Apr 16 10:45:16 EDT 2003 | Takfire
Recent cross-section analysis for a customer complaint revealed voiding in the solder fillet. In some cases, the remains of outgassing were also observed. During the failure analysis, we also observed failures where the solder fillet wicked on the
Electronics Forum | Wed Jun 18 06:41:34 EDT 2003 | emeto
Hi Jipp, If we are talking about 200-500 boards per month the main question is"Is it reasonable to go for semi-automatic production?". You will nead at least 1.Manual stencil printer 2.P&P machine 3.Infrared dryer or reflow oven Most expensive par
Electronics Forum | Thu Aug 21 09:34:57 EDT 2003 | davef
Woa. The more paste that you put a a BGA ball, the more likely that you'll bridge between balls. Why do you need to compensate for the size variance in BGA balls? How does using a 8 thou thick stencil to compensate for ball size variance? Fine pi
