Electronics Forum: after (Page 45 of 696)

Black pad on BGA after removal

Electronics Forum | Thu May 05 12:31:27 EDT 2005 | russ

Not in this case, these BGAs were lead free and the profile used was for a lead part. I guess I will give you the whole story. These boards were sent to us from a customer to have the BGAs replaced for an unknown to us reason. We removed the parts

Baking planars after new BGA placed.

Electronics Forum | Mon Aug 14 18:03:49 EDT 2006 | GS

Sure the bake need to be done after BGA replacement? Normally the board need to be backed before BGA replacement (not only)in order to avoid PCB delamination due to moisture entrapped during his life staing on field. Oven Temperature from 90 to 125

Contaminants after SMT which affect wire bonding

Electronics Forum | Thu Oct 05 16:04:00 EDT 2006 | GS

I am not expert, just my comment, the total ionic contamination allowed after SMT, by using No Clean process, theoretically it should be close to Zero. Any way the Standard IPC-JSTD-001 allows 1,56 ugr NaCl/cm2 for the final Printed Board assembled.

IP2 placing parts shifted after servo fixed?

Electronics Forum | Mon May 04 14:24:12 EDT 2009 | jimmyboz

Ok, So, If all the servo amps on H1 remained on H1 and the amp you changed is on H2, I have to guess the shifting on H1 is unrelated to the servo prob. Is the shifting unsolderable? if it just looks bad but will reflow, it may have been occurring f

Baking assemblies after ultrasonic water wash

Electronics Forum | Thu Jun 11 10:02:36 EDT 2009 | dyoungquist

Our cleaning process involves the assemblies being completely immersed in the water bath of the ultrasonic cleaner. The assembly has a QFP44 on it. Customer stated that when these assemblies have been cleaned with water in the past (at a different

Black color solder wetting after reflow

Electronics Forum | Tue May 03 21:14:19 EDT 2011 | davef

Can we talk some to better understand the scope and breadth of the problem? * From your picture, it looks as if the problem shows-up on some pads, but not others. Is this accurate? * Is this lot related? * Is this related to a few items from a lot? *

baking out pcbs after reflow process

Electronics Forum | Thu Jul 12 11:56:20 EDT 2012 | hegemon

You might try to complete all your soldering within a 72 hour or less time frame. For all intents treat your board like a moisture sensitive component after you have baked and completed SMT reflow. Wash, blow dry, and go direct to stuffing and com

Re: BGA problem: open after reflow

Electronics Forum | Tue Jan 30 02:29:16 EST 2001 | arul2000

Dave, To do further analysis we don't have the BGAs of the batch from which we had this issue. We don't face this issue now in the current production lots. The problem got solved while trying to find the root cause. Will keep updated if it occurs ag

Cleaning stencils after printing SMD adhesives

Electronics Forum | Wed Jul 11 18:32:34 EDT 2001 | Darby

Mark, We print and dispense with Amicon "D 125 F". Solvent used is Electrolube "SSS", which is also used for solder paste removal/pcb cleaning for misprints and rework both manually and ultrasonically. I like it - good stuff but at $25 AU per litre i

Re: Solder balls after wave soldering

Electronics Forum | Fri Jan 28 10:09:50 EST 2000 | mike d

Istvan, One possible reason for this is that you are using a water soluble flux in your wave solder machine. If you are and the boards are not pre heated long enough, the water in the flux does not evaporate before hitting the wave. When the water


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