Electronics Forum | Wed Aug 18 18:10:33 EDT 1999 | Mik Horvath
| | Hi, | | I'd like to ask some tips about the merits and shortcomings o | | of both screen printer and stencil printer. For small quantity and highly mixed usage, which type of printer is suitable to our | | application? | | The boards contain
Electronics Forum | Thu Aug 05 13:23:10 EDT 1999 | JS
| I am currently in the process of setting up an SMD Parts Package Database. The database will contain dimensional information to be used by the placement machinery to process parts (I.E Package Type, # of Leads, Lead dimensions, Lead pitch(s), etc.
Electronics Forum | Fri Jun 18 12:36:52 EDT 1999 | Brian
What is the future of HASL with lead-free solders? I have grave misgivings as, even if it works properly (which I'm not too sure about), the alloy will have to match that used in the soldering process, or nearly so. No use using a Bi-containing HASL
Electronics Forum | Sat May 08 11:53:52 EDT 1999 | Scott Cook
| My company has a product line that utilizes multi-up PCB's. In order to cut costs for this product line, I have been asked to look into ways of running panels that contain bad blocks. Our SMT equipment is quite capable of doing this, but I need to
Electronics Forum | Sat Apr 17 11:56:04 EDT 1999 | Graham Naisbitt
Mike First, you MUST make sure the oven used is extracted. The coating will contain TDI. This is not nice. You would be better considering a silicone solventless. Try contacting HumiSeal. They had a material on the TAC line at Nepcon West that lo
Electronics Forum | Wed Apr 07 21:31:25 EDT 1999 | Scott McKee
| DOES ANY ONE KNOW HOW I CAN STRAIGHTEN | BENT PINS ON A FINE PITCH QFP WITH OUT DAMAGING | THE CHIP. AT $300 A CHIP I CAN'T SCRAP THEM. | I use tweezers and picks. I place the component down on it's backside (legs up) and manually tweek them un
Electronics Forum | Tue Mar 23 10:22:17 EST 1999 | Chrys Shea
| Are there many of you who are soldering through hole parts in your surface mount reflow oven? How repeatable is the process? Do you need to touch up a lot after reflow? We don't do long runs maybe 200, 300 boards max. Can you just screen print
Electronics Forum | Tue Feb 02 12:31:26 EST 1999 | John
| I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product i
Electronics Forum | Fri Jan 15 15:29:03 EST 1999 | Jason Hall
| Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | Regards | Ji
Electronics Forum | Tue Nov 24 13:51:23 EST 1998 | Michael Allen
What kind of "slice and dice machine" do you use? I assume you're referring to what I call a score-breaker -- a device to separate the board from the panel (or from the adjacent board) by crushing the score-line WITHOUT bending the panel or the boar
