Electronics Forum | Tue Apr 25 13:05:08 EDT 2006 | Hoss
TMC, Are you interested in this approach because you only have a flat belt conveyor and want to keep the components from being moved by the belt on the second pass? If so, you might try adding some stiffeners to the board edges to stand the board o
Electronics Forum | Wed May 10 13:21:58 EDT 2006 | scombs
Thanks for the reply. We have carefully inspected the part and solder joint after depaneling and all looks good. What is weird is if you remove the part from the board and check continuity with a meter you have a dead short. If you put on a new part
Electronics Forum | Thu Jun 08 03:40:32 EDT 2006 | aj
Hi, I use convection reflow and both top & bottom settings are the same. Is the part too heavy to rely on surface tension? there is an equation that can determine this (aswell as real test i.e. part falling off) We have some SIM Card holders on bot
Electronics Forum | Fri Jun 16 08:45:35 EDT 2006 | Chunks
It's hard to say since cleanliness on my product may be acceptable, but may fail on yours. If you really are worried about flux residues, or need to pass some cleanliness spec, you may want to look into water soluable. Otherwise, most of the name b
Electronics Forum | Wed Jun 21 04:11:31 EDT 2006 | daxman
Are you familar with using the mecca mode on Fuji machines? There is a procedure I can take you through that will check the servo amp and allow you to adjust it. Is your machine useable at all? can you get it to pass zero set? If you can, view your s
Electronics Forum | Tue Jul 18 11:24:25 EDT 2006 | samir
This RoHS has created a new "underworld" of brokered parts --- parts dipped in Lead-Free alloy to pass as "lead free." I could see some guy with a fur coat and feathered boa hawking lead free parts on the street: "Check it ouuuttt...I got lead free
Electronics Forum | Fri Sep 15 12:30:05 EDT 2006 | Steve
If the package is robust enough to handle surface mount followed by a pass through the wave soldering process, we have had excellent results populating the fine pitch parts with the P&P machine, reflow, then mask the solder joints prior to wave solde
Electronics Forum | Tue Sep 19 22:55:21 EDT 2006 | darby
Hi Larry, me again. Painting the tip should do diddly because you are using laser. Your cap is probably passing because it's thicker and is just inside the range of the system set-up. Check and calibrate your nozzle alignment height settings. Input t
Electronics Forum | Tue Sep 26 16:44:18 EDT 2006 | df
All, We have a board that has failed at burn in. There is a 672 BGA on the board. When the test guy presses down on the BGA the board will pass ! What am I looking at here? Board finish is ENIG - could this be black pad / what should I do to diagn
Electronics Forum | Mon Oct 02 19:04:53 EDT 2006 | DC
We had a issue on the SBGA and found stress built up at the corner of the SBGA after cool down to room temperature. It is confirmed by the warpage analysis. I expected that the stress caused by the heat spreader and the epoxy to the copper frame. O