Electronics Forum | Wed Feb 17 11:31:37 EST 1999 | Bill Schreiber
Dear Al, Are these reworked, double-sided boards? If you attempt to clean side #2 of double-sided misprint in a "spray" type cleaner, millions of solder balls can be broadcast throughout the same chamber as the populated side #1. Or, if this is a s
Electronics Forum | Fri Feb 12 18:48:19 EST 1999 | Jon Medernach
Bill, You should wipe clean. The thin layer will dry out quickly and cause other problems. Remember squeegee down stop and squeegee pressure are seperate issues. If your downstop is to low the stencil and board will flex down, after the squeegee p
Electronics Forum | Tue Feb 09 18:48:21 EST 1999 | Earl Moon
| Has anyone had any experience in using SMT to mount an organic (FR-4, Getek) rider card onto an organic (FR-4, Getek) mother board? By SMT I mean the attachment of the rider card would be through pads directly to pads on the mother board. | | Than
Electronics Forum | Tue Feb 02 09:51:38 EST 1999 | Justin Medernach
| Hello Everybody: | | I am in urgent need of some information regarding the reflow profile for a flip chip wafer. Would the reflow conditions along with the flux used affect the appearence of the solder joints. | | We are witnessing dull solder j
Electronics Forum | Tue Feb 02 21:55:20 EST 1999 | Jon Medernach
Chris is correct. You will have a problem if you do not have the right metalization under your bump. The BM is critical, it is defined by the passivization layer on top of your die much like a solder mask defined interface on FR4. You will find mos
Electronics Forum | Mon Jan 25 21:43:04 EST 1999 | Dave F
| hi, | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier proces
Electronics Forum | Tue Jan 26 19:43:02 EST 1999 | Ross Berntson
| hi, | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier proces
Electronics Forum | Tue Jan 26 19:43:26 EST 1999 | Ross Berntson
| hi, | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier proces
Electronics Forum | Fri Jan 15 16:55:50 EST 1999 | Chrys
| | | Hello, | | | | | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | | | | | So far, the tests I can think of performin
Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.
Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process