Electronics Forum | Wed Oct 21 14:28:17 EDT 1998 | Earl Moon
| I'M LOOKING FOR A SOLVENT TO MAKE REMOVING EPOXY FROM THE BOTTOMSIDE OF BOARD ON SMT COMPONENTS. THIS IS MOST IMPORTANT AFTER THE EPOXY HAS CURED AND EVEN RAN THROUGH THE WAVE. I'M LOOKING FOR A WAY OF | MAKING THE REWORK PROCESS ON THE CURED EPOX
Electronics Forum | Thu Oct 22 15:10:00 EDT 1998 | Chris Fontaine
| I'M LOOKING FOR A SOLVENT TO MAKE REMOVING EPOXY FROM THE BOTTOMSIDE OF BOARD ON SMT COMPONENTS. THIS IS MOST IMPORTANT AFTER THE EPOXY HAS CURED AND EVEN RAN THROUGH THE WAVE. I'M LOOKING FOR A WAY OF | MAKING THE REWORK PROCESS ON THE CURED EPOX
Electronics Forum | Thu Oct 29 01:21:38 EST 1998 | Erhard
Thinking about that 180� turn unit again: You wouldn't require the the y-movement. The fixed side gets turned over to the other side anyways. | My suggestion would also be to leave the Fuji direction the way it is. (It's more standard anyways?) and
Electronics Forum | Mon Nov 16 07:08:54 EST 1998 | Michel SORGIUS
We have board handlers for automatization of lead trimmers. Michel | I have been requested to explore the possibilities of using an inline lead trimmer in our manufacturing process. I have a few questions I need answered. | 1. Can anyone recommen
Electronics Forum | Fri Oct 16 21:07:31 EDT 1998 | Scott McKee
| I need the following information on uBGA's - body size, ball pitch and ball diameter. Are they a plastic package (with the resulting moisture sensitivity of a PBGA)? Also, does the uBGA put any special requirements on pick and place equipment? |
Electronics Forum | Wed Oct 14 10:04:02 EDT 1998 | Dr. Kantesh Doss, Siemens Energy & Automation, Inc.
Sanjay: Keys to successful adhesive printing are: 1. Understanding the flow behavior of the adhesive under constant shear stress 2. Stencil design, i.e. stencil aperture opening 3. PWB Footprint 4. Stencil printing parameters Optimizing all these fac
Electronics Forum | Tue Oct 13 15:38:23 EDT 1998 | Dave F
All Y'll How do you clean components that must be added to an assembled board after water wash? BACKGROUND Our basic process goes like this: 1 Print paste with OA flux, place, reflow, wash 2 Repeat 1 3 Insert PTH, OA flux, wave, wash 4 Insert
Electronics Forum | Tue Oct 13 17:30:09 EDT 1998 | Upinder Singh
| All Y'll | | How do you clean components that must be added to an assembled board after water wash? | | BACKGROUND | | Our basic process goes like this: | | 1 Print paste with OA flux, place, reflow, wash | 2 Repeat 1 | 3 Insert PTH, OA flux
Electronics Forum | Fri Oct 09 23:17:05 EDT 1998 | kallol Chakraborty
| | I need to set a cleanliness limit for our incoming boards. I know that some people use 14-10 microgr. sq. in. But how can I determine what is best for me. | | Can anybody tell me if there's a standard for this. | | Right now we are using an Alph
Electronics Forum | Wed Oct 07 11:05:16 EDT 1998 | Dave F
| I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the remainin
