Electronics Forum: after (Page 469 of 658)

SIR Testing

Electronics Forum | Tue Jul 04 02:31:55 EDT 2006 | Mustang

Calling for an input from the Experts our there. Our customer is questioning the cleanliness of the no-clean product that we produced for them. We were asked to clean the board (localised cleaning) after rework (IC need to be changed due to an up re

SMT p&p new line

Electronics Forum | Wed Jul 19 11:18:04 EDT 2006 | fabione

Goodday,my name is Fabio and i'm smt tecnician manager of an italian company i must buy a NEW line smt. My end choose is: europlacer(Vitesse) or Mydata(My9+My9) or Siemens(CS+CF). if it's possible i would a yours considaretion about affidability and

EL Cap _ Missing & Shifted out of the Copper Pad

Electronics Forum | Fri Jul 21 03:51:06 EDT 2006 | Rob

Hi CKH, Here's some things to consider: 1) Moved by obstruction in/entering oven, such as nitrogen skirts 2) Incorrect air pressure/air leak in oven (large surface area on component) 3) Reflow temperature too hot & electrolyte/air in cap is expandi

Imm Silver & Screen Printing

Electronics Forum | Tue Aug 01 08:52:53 EDT 2006 | davef

We never changed any thing after moving to imm silver. "Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment * Proper aperture area ratio provide better release * Laser cut release bette

Recycling components

Electronics Forum | Thu Aug 03 12:51:20 EDT 2006 | Ofer Cohen

I'd appreciate your support in the following issue: A significant batch of PCBs failed on de-lamination. The failure was identified, of course, only after the assembly. There is a big variety of components (BGA 1mm, BGA 0.8 mm, FQPs and other SMT co

Recycling components

Electronics Forum | Thu Aug 03 12:51:59 EDT 2006 | Ofer Cohen

I'd appreciate advise in the following issue: A significant batch of PCBs failed on de-lamination. The failure was identified, of course, only after the assembly. There is a big variety of components (BGA 1mm, BGA 0.8 mm, FQPs and other SMT componen

Pcb immersion tin thickness

Electronics Forum | Wed Aug 09 08:06:07 EDT 2006 | davef

See "IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards" 3.2.1 Immersion Tin Thickness. The most common reason for solderability issues with the white tin surface coating during multiple thermal excursions is a thin white ti

PCB open trace repair

Electronics Forum | Wed Aug 09 19:14:15 EDT 2006 | Board House

Our Manufacturing policy regarding welds is as follows. 1) Inner layers - depends on Core thickness and line width. Our shop will not do any welding on core thickness less then 5 mils. or line width less then 5 mil. Good AOI practices reduce the a

Solder Ball After Reflow Process

Electronics Forum | Fri Aug 18 00:23:21 EDT 2006 | umar

Hi SWAG/Rush/Steve, Thanks for your response, Currently I am running with 811 lead paste. Actually this problem not only effect for one assy. I got 700 models runing at my company, but almost 50% of the model I have problem with solder balls issue.

Solder Ball After Reflow Process

Electronics Forum | Sat Aug 19 14:12:13 EDT 2006 | Wave Master Larry

LISTEN I'll have to disagree Steve.i think this Chunks person oversimplifies stuff and I dont like her style I'm surprised because most orientals do better with analyzing stuff.reminds me of some engineers at my place of employment.Again Im fighting


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