Electronics Forum: after (Page 470 of 658)

Solder Ball After Reflow Process

Electronics Forum | Mon Aug 21 10:17:08 EDT 2006 | Wave Master Larry

LISTEN I loose track of all this politically correct business and dont really know anymore who is what and what is who.do I say black or african american oriental or asian.I dont know anymore! In my generation we could say just about anything without

Solder Ball After Reflow Process

Electronics Forum | Mon Aug 21 11:58:54 EDT 2006 | Chunks

I believe you need to try to initiate the description of the criteria for requirements by developing a framework for the application architecture consistent with the planning corridor specified in our strategic initiative. Once bilateral goals are e

Fuji IP3 Problem

Electronics Forum | Sun Aug 20 02:31:18 EDT 2006 | daxman

Last week, when we turned on our IP3, we received an error on our IP3, which read "Fatal Error with VP Turn Power Off" We had been running product the day before, and the day after we received this error. The function keys are locked and will not w

Lead-free PCB: After Effect

Electronics Forum | Fri Aug 25 07:38:12 EDT 2006 | CL

Hi CP, I used to work for a flex circuit manufacturer. I am at a CM now and am we have started building RoHS production status assemblies. I personally think flex circuits will have a difficult time with the required temps for RoHS. I spoke to someo

Do yo have to bake unused bare boards or just Vacuum Pack?

Electronics Forum | Thu Aug 24 15:54:13 EDT 2006 | davef

It depends. What is: * Storage environment and period * Board laminate, epoxy, and copper thickness of PTH * Down stream process * Etc FR4 0.062" thick boards absorb between 0.08 to 0.1%Wt of moisture within a 24 hour period, and 0.2 to 0.23%Wt in

BGA Rework

Electronics Forum | Fri Aug 25 09:12:07 EDT 2006 | russ

When not practical to drill hole into pcb to profile here is what I do and seems to be just fine. place thermo into area underneath BGA and let her rip, you will not be in the ball/solder joint, but the temp difference as long as you are in the arra

Qualification requirements for immersion tin finish

Electronics Forum | Wed Aug 30 08:20:40 EDT 2006 | Bob R.

Are there any standard qualification/acceptance requirements for immersion tin board finish? J-STD-003 calls out temp/humidity preconditioning followed by solderability testing which is similar to what we have in our (ancient) internal documents. O

0.4mm PCB Thickness - production issues

Electronics Forum | Thu Sep 14 06:45:11 EDT 2006 | Rob

Hi Mika, We had roughly the same set up - AP27 -CP6x2, GSMx2, VIP98 & we ran the thin boards with durastone routed pallets. If you route out a 0.4mm pocket on the pallet and either use kapton tape/high temp masking tape/ or 3M spraymount to hold

SMT Edge Connectors

Electronics Forum | Fri Sep 15 16:30:13 EDT 2006 | russ

yes there is Caveman, (well maybe depending on your circumstances) you need to purchase a manual printer and print the connector then flip and print the other side. (you need a manual printer so you can print after the parts have nbeen reflowed, we

Quad 3c/4c Z-Rod Precautions

Electronics Forum | Wed Sep 20 15:25:15 EDT 2006 | lheiss

Hey All, Thanks for all of your help to date. While running the nozzle height test I noticed that the Z-rod is bent. Probably happened after setting the "X closed loop soft home" back to 50 from 384 which was probably why the nozzle slammed into t

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