Electronics Forum: (4) (Page 474 of 662)

Fuji Part Library Question

Electronics Forum | Thu Jun 28 11:51:24 EDT 2007 | mika

Hi, Are we talking about the pick-up tolerance so for any chip component set it to 0.5mm. It will save a lot of trouble right there. As for body tolerence if it is a zero then it will automatically use a standard value, based on the size of the body

GSM won't change nozzles ...

Electronics Forum | Mon Jul 09 11:19:07 EDT 2007 | swag

I could be wrong but I don't believe that you can start with any empty spindles. If it picks up nozzles, you will end up with more than one empty changer hole which will not work for the vacuum that is required to remove the nozzles from the spindle

J-STD-001 Par 4.2.2 Temperature and Humidity

Electronics Forum | Mon Jul 16 15:44:27 EDT 2007 | davef

J-STD-001 doesn't necessarily require additional controls under conditions of low humidity, only that you verify the effectiveness of what you have in place. ESD S20.20 [1999] only says that relative humidity above 30% is "desirable". ESD S20.20 [200

Aluminium board

Electronics Forum | Tue Jul 31 22:06:12 EDT 2007 | davef

We had no problems reflowing an assembly on Bergquist Thermal Clad. The assembly was small. So, we built it on a 8-up fixture. It stayed in the fixture from screen print, through pick and place, and into reflow. When the fixture came out of the r

Delamination on IS410 laminate

Electronics Forum | Tue Jul 31 15:33:30 EDT 2007 | gregs110

I have seen a few threads about delamination issues on IS410 laminate in RoHS applications. I have recently been running into a rash of issues on 4 different part numbers with a single PWB source. All the parts have been built fine in the past with

PWAs & PWBs bake out requirements

Electronics Forum | Sat Aug 11 09:33:09 EDT 2007 | davef

Tran First, you never spoke of J-001DS in your initial post. Second, J-STD-001DS requires no baking of assemblies, only boards [and for the anal, components]. J-STD-001DS, 4.9.3 Drying/Degassing. Prior to soldering, the assembly shall be treated to

Universal 4796B Questions...

Electronics Forum | Mon Aug 13 14:23:54 EDT 2007 | ratsalad

Ben, I'm glad I could help. Since I've rewritten the code in Java, and I think it's much nicer now. We still don't have an AOI in place, so I don't know what is happening with that. There are Windows versions of UCT you can use for

Universal GSM1 manual

Electronics Forum | Fri Aug 17 05:58:29 EDT 2007 | dilogic

Hi, your machine is exactly the same configuration as mine. I even think we both bought them from the same seller ;-). Anyway, it's BLOCK-I with (most probably) USOS V1.4.14 software running on OS/2. I've registered the software with UIC for 400 E

PCB pad contamination

Electronics Forum | Tue Aug 21 05:05:52 EDT 2007 | vangogh

Hi All, I would like to get some inputs regarding this.... I have bare PCB which were stored with kapton tape attached on the Au plated pads. These were stored for close to a year. Upon removal of kapton tape, we noticed discolorations on the edges o

Solder Balls and Humidity

Electronics Forum | Tue Aug 28 11:12:23 EDT 2007 | grics

This is what I was thinking, but I am being beat up pretty badly by the selective solder. Ambient temperature is anywhere in the the neighborhood of 76 - 80 degrees F. I am not sure of the RH, but I wouldn't think that would be my issue... One of


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