Electronics Forum: stencil (Page 476 of 572)

DEK Horizon 03i

Electronics Forum | Wed Jan 24 15:49:32 EST 2024 | carlos_s39

Hi all, Recently the place where I work at purchased an SMT assembly line. The stencil printer is a used DEK Horizon 03i. We received no manuals with it and are having issues with the cleaner. The motor does not move and it does not move along the ra

Solder Paste Evaluation

Electronics Forum | Wed Jan 11 22:47:31 EST 2006 | davef

We didn't intend to light anyone's fur on fire [get anyone's underwear in a knot, roil the waters, have a cow man] about consultants. The Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste

How to choose a new solder paste

Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef

Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly

Re: adhesive printing

Electronics Forum | Tue Oct 31 03:50:20 EST 2000 | JohnW

Honda, Prnting Glueisn't as difficult as it sounds, as long as you have the right stuff and a good set up. It also depend's on what your going to be placing. If your just doing 0603, 0805 and 1208 than you really only need an 8 thou or 10 thou stenc

Re: Micro solder balling

Electronics Forum | Tue Oct 31 14:52:25 EST 2000 | Dr. Kantesh Doss

Hi Antonio: You clearly have printed excessive amount of solder paste on the pad. You can reduce the amount of paste by one or two methods: 1. Switchover to 5 mil thick stencils. 2. Change the design of your stencil openings (at the discrete compone

Re: Solder paste SPC analysis

Electronics Forum | Wed Oct 25 10:11:09 EDT 2000 | Wolfgang Busko

Paddesign, aperture size and stencil thickness determine the amount of solder for your joint. Once you have found suitable parameters you need to control the volume of your paste deposit which is influenced by printer settings, paste condition, stenc

Re: Adhesive Dispenser Vs. Screen Printing Adhesives Pros and Cons

Electronics Forum | Tue Oct 03 20:35:23 EDT 2000 | Dave F

1. Throughput * Dispenser: Slower, may loose 70% of tact on fast chip shooters * Printer: Can be put in front of and use fast chip shooters effectively 2. Rework Rate ???? Deposition control???? * Dispenser - High control over amount paste - Coplan

Re: Clamshell printers

Electronics Forum | Thu Aug 03 19:49:16 EDT 2000 | Darby

I presume you have no vision alignment. Buy yourself a little monocular measuring microscope ( about $100 ). You are not going to get the registration you require between stencil and pcb for each print if you are running off tooling pins , edge clamp

Re: Clamshell printers

Electronics Forum | Fri Aug 04 12:57:34 EDT 2000 | Steve Thomas

James, we used to use 3 clamshell type printers (one of which did have a two camera vision system, and did all our fine pitch), but had limited success with 20 mil pitch. 25 mil pitch was no problem. I suspect that you'll find people that have had

Re: Soldermask Design Rules

Electronics Forum | Fri Jun 16 06:24:43 EDT 2000 | Wolfgang Busko

Hi Todd, it might be a philosophical question if soldermask between finepitch pads is prefered or not. That should depend on the capabilities of a particular site and their experience. We actually prefer soldermask down to 0,4mm pitch and don�t have


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