Electronics Forum | Thu Feb 13 10:38:33 EST 2003 | vortex
While trying to develop new programs for our DEK Horizon 265 we are forced to use pads as vision alignments due to lack of real fiducals, thanks engineering. My question is, Is there any way to narrow the search window when performing a locate fiduca
Electronics Forum | Fri Feb 21 11:33:47 EST 2003 | Jaime
Call your glue manufacturer. It sounds to me that the epoxy is not curing properly. You should also test for shear strenght. How many pounds of pressure does it take to "pop" a cured component after it comes out of the oven? What type of oven do you
Electronics Forum | Tue Feb 25 10:32:09 EST 2003 | davef
I don't know the precise scheme, but it goes something like this ... WHAT TO DO * Use the general work instruction that applies to all boards. It goes into dimension and hole checking processes. It talks to visual instection of solder mask, solder
Electronics Forum | Tue Mar 04 17:02:50 EST 2003 | davef
Do the numbers. A good dog needs maybe $100k per year. So at 10%, he's got to sell $1M the first year. In order to sell $1M, he looks at the odds, scratches himself, licks his nose, and thinks, "ooo baby, this is pretty risky": * These guys don'
Electronics Forum | Wed Mar 05 02:50:31 EST 2003 | MA/NY DDave
Hi Excellent David F. I don't know about the company CAL is working for but I will tell you that sometimes companies hire a weak talent and convince them that they have a high sales potential. They offer a big commission yet a low salary in the 30K
Electronics Forum | Fri Mar 07 21:02:21 EST 2003 | neil
When printing below .5mm pitch, the recommended stencil thickness is 5Thou, laser cut. Do not use any reduction and ensure wherever possible the pad to space ration is 1:1, the length of the pad is not as important as the gap between adjacent pads. T
Electronics Forum | Sat Mar 08 11:04:47 EST 2003 | Joe
Mark, You've already received some good advice from the other posters. The one thing I would add is that even if you solve your printing issues on this type of part, the relative small quantity of paste may be prone to soldering problems. Ever s
Electronics Forum | Thu Mar 06 11:36:37 EST 2003 | O' Connor
Hi, I'm experiencing a problem on a standard part made many times before -Ni/Au finish PCB, Reflow 100% SMD parts. After reflow the gold on the pads does not fully fuse with the solder paste it remains intact on the extremities of the pads, it seems
Electronics Forum | Sat Mar 08 21:31:17 EST 2003 | MA/NY DDave
Hi Yes DavidF I agree, and that is what I think I am reading in the orginal and follow on post from the poster. I think this problem is just below full failure to solder which was your point, I think. You, and I particularly, are taking opposing y
Electronics Forum | Wed Mar 12 16:04:24 EST 2003 | O' Connor
Everybody thanks for all your help, the problem has been solved. Before I describe the solution I've got to own up, I'm the PCB Design Eng., The Process Eng. lobbed this problem onto my desk last week, said the problem lay with the PCB finish, whats
