Electronics Forum: stencil (Page 483 of 540)

Skewed components

Electronics Forum | Mon Mar 19 05:51:24 EDT 2007 | pima

Hello I made some test on different oven and problem still occurs. The only progress is that with diffrent thermoprofil ( Ramp to Spike instead of Ramp- Soak- Spike skewed components appears at 1 % of produced parts). With Ramp - Soak-Spike we have p

i want to know what i need to made a manufacturing line for smt

Electronics Forum | Thu Mar 15 17:33:20 EDT 2007 | Darby

As you are new to this - start with lots of hair and slowly reduce. Start with one good person. Spend the money on someone who knows the process, can set it all up, (including air, power, alignment, calibration, programming, troubleshooting, stenc

Solder paste shifted from pad

Electronics Forum | Fri Mar 16 23:38:36 EDT 2007 | mika

I don't understand so please explain in more detail. You say ~0.3mm shifted. In what direction is the paste shifted? is it shifted the very same directions on all panels? Only on this product or even with regular pcb:s? What is the size of the panel

LGA36 6.5 x 3.5 mm

Electronics Forum | Sat Mar 24 03:06:55 EDT 2007 | aj

Hi Mika, We came across some difficulties with this type of device a couple of years back . After the proto run we needed to touch up the outside fillets to get stability and product to pass test. ( even though the manf. stated that there is no fill

MLF / QFN Lead Free Shorting

Electronics Forum | Mon Apr 09 16:48:27 EDT 2007 | ratsalad

How wide are your pads? What paste are you using? What is your board finish? Could you please post a link to the datasheet for the component? We place a lot of MLFs, both in a Pb and Pb-free process. Our standard stencil design for MLF compon

solder paste measurement machine

Electronics Forum | Thu Apr 26 09:03:35 EDT 2007 | ck_the_flip

3d is good for initial verification that your screen printer and stencil is producing the desired paste height. 2D verification is more than sufficient during regular production. That being said, your best bet for a 3D machine is to go cheap - buy

BGA - Unmasked Vias

Electronics Forum | Thu Jul 12 10:15:12 EDT 2007 | swag

I've got a proto build (3 boards) that has a Xilinx FG456 fine-pitch BGA on it. Every BGA pad on the PCB has an unmasked via attached. Between the via and the pad is a thin soldermask strip, maybe .005" wide at best. I am very confident it will br

Conductive contamination and the elusive solution

Electronics Forum | Fri Jul 13 16:45:37 EDT 2007 | losersk8er

The Contamination has proven to be pretty random, lots of stainless steel though in fact two cases in the past two days. As far as I know all machinery is cleaned regularly as well, even the stencil washer itself. The boards we make are 90% (at l

Placement costs

Electronics Forum | Tue Jul 24 08:44:17 EDT 2007 | rgduval

Ron, I'd agree that that sounds high. Some things that may be contributing to it: Volume. lower build quantity often leads to higher placement costs. NRE. Does this website quote an NRE for solder stencils, machine programming, and reflow profili

CF CARD issue

Electronics Forum | Sat Aug 11 05:29:31 EDT 2007 | johnz

We are having a problem with JST connector ICM-MA50H-SS52-1161 LF SN. After reflow oven soldering we have mostly problem with soldering quality for firs or last leg of the connector. (There is no connection- leg just lays-lift on the solder no wicki


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