Electronics Forum: stencil (Page 484 of 540)

Solder Joint Strength Comparison

Electronics Forum | Tue Sep 04 10:48:49 EDT 2007 | lloyd

How do other people check their solder joint strength after a process change? For example, say you are getting wetting problems and you feel that a change to the reflow profile may help, or perhaps a slight change to the stencil aperture to reduce so

Solder Joint Strength Comparison

Electronics Forum | Wed Sep 05 10:59:02 EDT 2007 | slthomas

What's sad is, it really happened. I won't bore you with the details again. ;) Lloyd, I would love to have a nice Hi Scope too (I think Cchunks works for one of those big champagne and caviar corporate entities ;)) but if you can't swing it, at leas

MPM AP/A Problem

Electronics Forum | Mon Sep 24 07:38:01 EDT 2007 | chrispy1963

I never saw in any post if your machine uses the camera to find the board edge or if your machine uses the bottom front rail mounted board stop sensor. Also is this with only one particular job you run on this machine or is this happening with ALL

Epoxy on bottom of SMT component

Electronics Forum | Tue Nov 27 20:05:31 EST 2007 | shy

Dback, Current method is by using dispenser machine to dispense the glue at PCB. This non-wetting is randomly and not repeating to the same location. My adhesive height is 0.01" to 0.035". Is this will cause the component to had a gap between the t

Epoxy on bottom of SMT component

Electronics Forum | Thu Nov 29 15:08:56 EST 2007 | jaimebc

Shy, You mentioned that you are using "dog bone" apertures for your chip components? It doesn't make sense to me. I thought that the "dog bone" was used for fine pitch devices, to keep the solder away from the center and avoid bridging. It doesn't

Stencil Printing: Single pass vs. Double pass

Electronics Forum | Wed Dec 19 18:41:33 EST 2007 | darby

You printer is not solely designed for printing solder paste. This is why some of the options you would never use for paste appear in the menu. You may actually be printing overlays or yes, even t-shirts. This is why you may want to flood/print, prin

Affordable Inspection Microscopes?

Electronics Forum | Tue Jan 15 15:53:14 EST 2008 | jmelson

I only build my own products, so it has to meet my needs for QA only. I am doing some 20 mil lead pitch (0.5mm) and will soon be doing a 0.4 mm pitch part. I have more magnification on my microscopes (40X) but almost never need to go that high. If

Salary Ranges

Electronics Forum | Tue Jan 29 14:19:29 EST 2008 | operator

Well, here it is. My responsibilities: 1.All Documentation (build packets, processes docs, etc...Even some administrational docs) 2. Oven profiling and everything that goes with it (customer interaction, board& component baking ) 3. ESD program et

BGA Voids

Electronics Forum | Tue Feb 12 17:57:42 EST 2008 | chef

I must ask the silly question- are you sure you deposited the correct amount of paste? Depending on aperature design-the voiding could come from a stencil that has its holes partially built up with old paste. If paste volume is guaranteed, then what

Solder Splash

Electronics Forum | Wed Jun 18 09:13:44 EDT 2008 | realchunks

You're barking up the wrong tree. Solder "splashes" are generally caused by your print being off pad a bit. They are called solder fines. I've never seen a placement machine have the capability to push paste around using it's kiss-off from the noz

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