Electronics Forum: stencil (Page 486 of 572)

What's The Waste?

Electronics Forum | Tue Feb 20 13:10:54 EST 2001 | billschreiber

Hello Dave, Before I get into waste management, I must first stress the importance of checking with your local regulating agencies. Every area can be and usually is different. California regulations differ from Ohio and Ohio�s are different than Mu

via as test point

Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef

First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us

Re: Solder Beading Solder Balling

Electronics Forum | Thu Aug 05 12:20:06 EDT 1999 | John Thorup

| | | | | | | | | | | | | | | Hello, | | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem

Re: Solder Beading Solder Balling

Electronics Forum | Sat Aug 07 11:47:47 EDT 1999 | JohnW

| | | | | | | | | | | | Hello, | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chi

Re: BGA Shorting problem

Electronics Forum | Wed Sep 02 08:52:13 EDT 1998 | Justin Medernach

| | We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | | Our pad design is .020" diameter pads with .025" solder resist diameter. Th

Post Script

Electronics Forum | Tue Sep 01 10:39:30 EDT 1998 | Mike

| | | We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | | | Our pad design is .020" diameter pads with .025" solder resist diameter.

Tombstone

Electronics Forum | Tue Aug 28 13:08:28 EDT 2001 | seand

Hello Everyone, Mountains and mountains of data in the archives. As a contractor the variables in your production lots don't help I'm sure. On a larger scale, one suggestion maybe to first look at when and where your tomb stoning is occuring. 1

Re: BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 13:28:31 EST 2000 | Dave F

Robert: Ah, opinions are like mothers, everyone has one. Here's mine: 1 Goto the Altera site, get a copy of "AN 114," follow it. Generally, manufacturers are closer to the requirements of their components than others are. 2 Metal showing on the b

Re: ENIG finishing

Electronics Forum | Tue Feb 15 11:48:30 EST 2000 | Steve Thomas

Thanks for your responses, gentlemen. I'm really just looking at options, and frankly, being a novice at this stuff I'm looking for the info. required to make a semi educated decision. You, kind sirs, are my educators. And that probably scares m

Re: Solder Beading under Cap...Need help

Electronics Forum | Fri Feb 11 09:48:56 EST 2000 | Christopher Lampron

Dear Masdi, Solder beading (as opposed to solder balls) is usually caused by volume of solder paste, displacement of solder paste when component is placed and sometimes the proximity of the solder depositions for that component. Basically, a small a


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