Electronics Forum | Fri Feb 11 09:48:56 EST 2000 | Christopher Lampron
Dear Masdi, Solder beading (as opposed to solder balls) is usually caused by volume of solder paste, displacement of solder paste when component is placed and sometimes the proximity of the solder depositions for that component. Basically, a small a
Electronics Forum | Mon Jan 08 17:46:38 EST 2001 | Mark Krmpotich
Panasonics are good machines as long as you do the proper and timely PM's they recommend. Plus with my past history and from others that I here, their feeders are some of their biggest down fall. That's typically why they have to introduce new style
Electronics Forum | Thu Nov 30 04:02:26 EST 2000 | Chris May
Michael, Thanks for your response. More info:- The processes are as follows, Stencil Print (6 thou on DEK 248) Placement on Contact 3AV and Reflow on BTU 4 zone Top & Bottom oven.It is not an In-Line system. Our board technology is mixed but heavi
Electronics Forum | Sat Oct 07 04:02:50 EDT 2000 | C.J. Long
Good morning, All: I am from PCB shop and one of our customer is experiencing solder bridge on 16 mil pitch QFP( immersion gold finish). Land width requirement is 8 +/- 1 mil measured over top of of land and our mean is 7 mil. Bottom land width is 8
Electronics Forum | Wed Aug 16 05:20:29 EDT 2000 | Wolfgang Busko
Richard, take a given volume and weigh it. For your parts you have already determined the aperture opening and stencil thickness and that gives you the volume for each lead of the component. This way you should be able to determine the amount of pas
Electronics Forum | Fri Aug 18 05:43:51 EDT 2000 | Richard Berry
Thanks Wolfgang / Charles Have tried method suggested by Wolfgang on one product, and seem to be a bit over (perhaps density calculation was a bit out). Also, the volume of paste deposited must be less than the voume of the apetures on the stencil b
Electronics Forum | Sat Aug 05 09:06:40 EDT 2000 | Dave F
I'm confused ... Land Grid Array (LGA). An alternative to the BGA for device manufacturers is to package their devices without any terminations on the bottom. Although not technically accurate, the easiest way to envision an LGA device is to pictu
Electronics Forum | Mon Jul 24 18:19:08 EDT 2000 | Darby
Nick, Like John says, it will only be a short time and you will "just know". In the meantime you might want to try - 1. All the placement machine manufacturers have show pcbs for the exhibitions, many of these show pitch and package types on the silk
Electronics Forum | Fri Jun 02 09:31:26 EDT 2000 | C.K.
Okay, there's a debate here at my company. We build a card here that, often times, we get batches where there is excess HASL in the VIA hole barrels. Here is the problem that this causes: During the "1st reflow", the excess HASL bleeds out of the
Electronics Forum | Fri May 26 02:22:18 EDT 2000 | Sal
Generally a good and safe option when selecting a printer, A rhobust machine with good process capabilities. We print anything from 0402's to CCGA's using proflow, as well as print adhesive with no problems. The 265 ranges from the MK1 TO Infinity mo
