Electronics Forum | Tue Sep 21 12:57:01 EDT 1999 | Chris McDonald
| | | I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. | | | My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. | | | | | | Thank you. | | | |
Electronics Forum | Tue Sep 21 13:17:29 EDT 1999 | Dave F
snip | I've often been tempted to try something a little different when specifying QFP apertures. Like, for example, using long, tapered triangular apertures arranged in alternating directions. The objective being, get the maximum amount of paste do
Electronics Forum | Tue Sep 14 10:25:37 EDT 1999 | Earl Moon
| I'm hoping to use 0201 caps and resistors in a new design but so far have only found one company who makes such small devices (Murato). | | Can anyone direct me to any other supplier? | | Are there any particular problems associated with using s
Electronics Forum | Tue Sep 14 13:27:57 EDT 1999 | Scott S. Snider
| Can anyone out there pls enlighten me on how to solve chip tombstone defects. | I am running a board with a lot of 0603 chip. i had fine the profile and the alignment, but it still happen randomly on the board itself. Is there any other way to sol
Electronics Forum | Fri Sep 10 15:20:34 EDT 1999 | Jennifer
Okay guys (and my fellow lady lurkers), I am trying to determine WHAT the segmentation is for the products in the pick and place industry. For example, I know in screen/stencil printing, there are manuals, there are semi-automatics, mid- and high-ra
Electronics Forum | Fri Sep 10 15:15:24 EDT 1999 | Jennifer
Okay guys (and my fellow lady lurkers), I am trying to determine WHAT the segmentation is for the products in the pick and place industry. For example, I know in screen/stencil printing, there are manuals, there are semi-automatics, mid- and high-ra
Electronics Forum | Mon Aug 30 03:56:35 EDT 1999 | Wolfgang Busko
| Planning to evaluate the above process... | Can anyone can give me some tips/infos on the above.... | e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, is the profile different from a
Electronics Forum | Mon Aug 30 04:08:51 EDT 1999 | Earl Moon
| | Planning to evaluate the above process... | | Can anyone can give me some tips/infos on the above.... | | e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, is the profile different
Electronics Forum | Thu Aug 26 10:28:07 EDT 1999 | Stuart Adams
What are the key steps to achieving high yield with CSP ??? (We are trying qualify vendors for volume fab/assembly of some products which use several CSP devices on each side of the board. (Some with 0.5mm ball pitch)) Looking through the forum I
Electronics Forum | Thu Aug 26 04:22:26 EDT 1999 | JAX
| | | | | | | Hello everyone, | | | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Than
