Electronics Forum: stencil (Page 496 of 571)

Re: Solder Spotting on Gold

Electronics Forum | Tue Aug 18 11:45:17 EDT 1998 | Zambri

| Bob | I have had problems with spotting on gold contacts for many years and have spent many hours working on ways to solve this problem. Once a source of the problem is found and corrected the next month another source will crop up (new operator o

Re: Tombstones

Electronics Forum | Thu Aug 06 12:16:52 EDT 1998 | Rin

| I'm currently running a double sided paste smt board loaded with 0603's, on the secondary side. Many of the 0603 devices tombstone during reflow if the parts are not perfectly centered on the pads. Is this caused by the .008 foil thickness? Has any

BGA reflow profile

Electronics Forum | Mon Jul 27 13:59:11 EDT 1998 | Robert Steltman

We are about to run our first BGA devices and would appreciate some confirmation on a few points. First some details: PCB & Device: ============= 1) 16 layer (4 power, 4 gnd, 8 signal) 2) gold on nickel finish 3) ceramic BGA with eutectic balls Refl

Re: Treading on dangerous ground

Electronics Forum | Thu Jul 23 13:11:13 EDT 1998 | Gestapo Allen

I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the rew

Re: Treading on dangerous ground

Electronics Forum | Tue Jul 28 16:37:24 EDT 1998 | Terry Burnette

| I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the r

Re: $.02 on DEK 265 GSX PRINTER

Electronics Forum | Fri Jul 17 06:49:28 EDT 1998 | smd

| Have you tried the TETRA frame with exchangeable stencil foils? | See how the TETRA frame works by looking at www.micromet.co.uk. | The frame to use with the DEK is now available in the U.S. | Call me at (408)562-2033 for more information. | You'l

Re: Temperature & Humidity Effects on Solder Paste

Electronics Forum | Fri Jul 17 11:49:58 EDT 1998 | Justin Medernach

| My question is in regards to how exactly temperature and humidity affect the stencil printing process. If temperatures here at the plant in the summer are 70-73 degrees F. and relative humidity is 60-65%,to what extent will the results of the ste

Re: Using solder paste/reflow for leaded thru hole parts .

Electronics Forum | Fri Jul 03 09:29:19 EDT 1998 | Dave F

| Hi all. | I am trying to put one 20 pin thru hole connector along with the smt components on the PCB. I would appreciate if somebody can guide me in getting thru this process. I also need to know how much bigger the holes on the screen or stencil

Use of solder paste for leaded thru hole parts????

Electronics Forum | Tue Jun 30 12:48:59 EDT 1998 | Upinder Singh

Hi all . Thanks to Ryan, Brian , Justin and Dave for the timely help earlier. I would appreciate if somebody could help me in the stated issue: I am trying to to place one thru hole 20 pin connector along with the SMT components by paste printing an

Re: Use of solder paste for leaded thru hole parts????

Electronics Forum | Fri Jul 10 14:23:23 EDT 1998 | Bob Willis

You can get a report and CD ROM on pin in hole reflow assembly from the SMTA main office in the USA. They also have a new report on Double Sided Reflow Design and Assembly. | Hi all . | Thanks to Ryan, Brian , Justin and Dave for the timely help ear


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