Electronics Forum | Thu Aug 24 15:54:13 EDT 2006 | davef
It depends. What is: * Storage environment and period * Board laminate, epoxy, and copper thickness of PTH * Down stream process * Etc FR4 0.062" thick boards absorb between 0.08 to 0.1%Wt of moisture within a 24 hour period, and 0.2 to 0.23%Wt in
Electronics Forum | Fri Aug 25 09:12:07 EDT 2006 | russ
When not practical to drill hole into pcb to profile here is what I do and seems to be just fine. place thermo into area underneath BGA and let her rip, you will not be in the ball/solder joint, but the temp difference as long as you are in the arra
Electronics Forum | Wed Aug 30 08:20:40 EDT 2006 | Bob R.
Are there any standard qualification/acceptance requirements for immersion tin board finish? J-STD-003 calls out temp/humidity preconditioning followed by solderability testing which is similar to what we have in our (ancient) internal documents. O
Electronics Forum | Thu Sep 14 06:45:11 EDT 2006 | Rob
Hi Mika, We had roughly the same set up - AP27 -CP6x2, GSMx2, VIP98 & we ran the thin boards with durastone routed pallets. If you route out a 0.4mm pocket on the pallet and either use kapton tape/high temp masking tape/ or 3M spraymount to hold
Electronics Forum | Fri Sep 15 16:30:13 EDT 2006 | russ
yes there is Caveman, (well maybe depending on your circumstances) you need to purchase a manual printer and print the connector then flip and print the other side. (you need a manual printer so you can print after the parts have nbeen reflowed, we
Electronics Forum | Wed Sep 20 15:25:15 EDT 2006 | lheiss
Hey All, Thanks for all of your help to date. While running the nozzle height test I noticed that the Z-rod is bent. Probably happened after setting the "X closed loop soft home" back to 50 from 384 which was probably why the nozzle slammed into t
Electronics Forum | Fri Sep 22 09:45:26 EDT 2006 | bradlanger
Greg, All the above. It looked like it was going to be a drop for SNPB HASL at first but after a few thousand boards we started running into all the problems you are describing. We first started seeing non wetting on SMT pads. The solder would wet t
Electronics Forum | Mon Sep 25 09:18:38 EDT 2006 | daxman
Thanks for the posts guys, I'd like to mention a few things... In my opinion, the tooling does not get any better than this. The board is fairly small and quite stiff. There is no board warping. The tooling plates are tight and the vacuum really h
Electronics Forum | Tue Oct 17 18:15:39 EDT 2006 | daxman
Hey all, I just though I give you all a quick update. I managed to get the printer working. The problems were a combination of everything that was discussed here. When I adjusted the GS4 pot for the histogram, I turned the wrong one at first. This t
Electronics Forum | Thu Oct 05 10:37:10 EDT 2006 | David
Hello all, We have problem with voids in one of our product. We are soldering IC (package SO8) with under the components grounding connection. The ground pad for this component has 3 via holes (before producing we have to cover this 3 holes from b
