Electronics Forum: stencil (Page 503 of 540)

Re: Product Segmentation in Pick Place Machines?

Electronics Forum | Sat Sep 11 13:44:48 EDT 1999 | Dean

Okay guys (and my fellow lady lurkers), I am trying to determine WHAT the segmentation is for the products in the pick and place industry. For example, I know in screen/stencil printing, there are manuals, there are semi-automatics, mid- and h

Re: Product Segmentation in Pick Place Machines?

Electronics Forum | Mon Sep 13 10:55:44 EDT 1999 | K3 Equipment

Okay guys (and my fellow lady lurkers), I am trying to determine WHAT the segmentation is for the products in the pick and place industry. For example, I know in screen/stencil printing, there are manuals, there are semi-automatics, mid- and h

Re: Product Segmentation in Pick Place Machines?

Electronics Forum | Fri Sep 10 15:40:30 EDT 1999 | Earl Moon

Okay guys (and my fellow lady lurkers), I am trying to determine WHAT the segmentation is for the products in the pick and place industry. For example, I know in screen/stencil printing, there are manuals, there are semi-automatics, mid- and h

Re: Standard pad sizes for reflow and wave

Electronics Forum | Tue Sep 07 09:11:33 EDT 1999 | Dave F

We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes

Re: BGA open

Electronics Forum | Thu Sep 02 12:01:49 EDT 1999 | stefano bolleri

Could someone shares their experience on the causes of 'Open' in the BGA after reflow. Are you talking about "primary" process or rework? Are you sure you have not clogged apertures on your stencil? What is the pitch of the balls? My experie

Re: SPOT (Solder Paste On Thru-Hole)

Electronics Forum | Mon Aug 30 11:20:12 EDT 1999 | John Thorup

Planning to evaluate the above process... Can anyone can give me some tips/infos on the above.... e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, is the profile diff

Re: SPOT (Solder Paste On Thru-Hole)

Electronics Forum | Mon Aug 30 12:02:16 EDT 1999 | Brian Wycoff

Planning to evaluate the above process... Can anyone can give me some tips/infos on the above.... e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, is the profil

Re: SPOT (Solder Paste On Thru-Hole)

Electronics Forum | Tue Aug 31 03:37:19 EDT 1999 | Wolfgang Busko

Planning to evaluate the above process... Can anyone can give me some tips/infos on the above.... e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, is the

Re: Digital Camera

Electronics Forum | Tue Aug 24 02:25:44 EDT 1999 | Earl Moon

This is out of the normal scope of this site but� I am in search of a Digital Camera for use with documentation instructions. What would be the Minimum Resolution that I should require? I will need details of assemblies such as Compone

Re: Help for CSP Prototyping

Electronics Forum | Sat Aug 21 17:10:12 EDT 1999 | K. Vikas Sharma

Want to know the Tools/ Process required to get started with CSP prototyping and R & D. Anyone working on this , please help out. Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went through p


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