Electronics Forum: contains (Page 51 of 83)

Urgent!! ... AI process after SMD Reflow Soldering

Electronics Forum | Thu Sep 15 22:00:17 EDT 2005 | LeeHoMa

hi Stephen, Thank for your comment! Yes! My people also share the same view that customer is asking something which is in more theoretical side. They want us to collect a lot of statistical data to prove our process. Anyway, customer is not only

Manual Stencil Cleaning Solvent

Electronics Forum | Mon Oct 10 16:02:58 EDT 2005 | pjc

If you don't have a machine, such as from these guys: http://www.pressureproducts.com/SPPC_Hm.htm http://www.smartsonic.com/index2.html http://www.aqueoustech.com/Ultrasonic_Series_Data.htm http://www.emcgti.com/products/product_list.php?cat=8&ca

Solder sticking to Stainless Steel Fasteners

Electronics Forum | Wed Oct 12 20:53:44 EDT 2005 | mderen

We are currently wave soldering connectors that are held in place by stainless steel screws. About 20% of these screws emerge from the process with varying quantities of solder attached to them. We have just had our solder bath checked and no impurit

does copper wire become thinner when it dip to leadfree solder?

Electronics Forum | Wed Nov 02 01:30:12 EST 2005 | fctassembly

Hello Arnold, Yes, by definition of joint formation, copper will dissolve in lead free solder in order to form the connecting intermetallic layer. There is a distinct difference in the copper dissolution rates of the major alloys being considered wi

Help!!

Electronics Forum | Tue Nov 08 20:50:03 EST 2005 | davef

First, general comments about voiding in wave soldered connections are: * Causes of voids in solder connection are many: moisture, flux/paste volatiles, wave process, etc. * Impact on reliability of voids in a PTH solder connection is insignificant,

Solvent for stencil cleaning

Electronics Forum | Thu Nov 10 07:57:51 EST 2005 | davef

AJ: Problems with IPA are: * IPA / material being 'cleaned' combination still needs to be removed from the stencil. * IPA and empty containers are a hazardous material by RCRA criteria (40CFR 261) * Flash point (~12*C TCC) of IPA is low enough that a

Pb % contaminant allowed in Pb/Free Solder

Electronics Forum | Fri Nov 11 10:19:35 EST 2005 | davef

0.3 mg/l) is a �hazardous substance containing waste�. Disposal permitted only in controlled landfills, mfrs. pay extra costs (Waste Disposal and Public Cleansing Laws). * South Korea: Korean Electronics Industry Declaration to Manufacture Environmen

Lead free tin copper only

Electronics Forum | Wed Feb 08 04:08:35 EST 2006 | fctassembly

Hello Greg, I agree with you that the article in SMT Magazine should be studied very carefully as it contains many errors in respect to SN100C. The testing performed was a DOE and was not an optimized run. There is also a statement on dross generatio

Stencil and board Ultrasonic cleaner

Electronics Forum | Wed Feb 01 13:46:05 EST 2006 | Chunks

Sounds like a epididymis! It depends on your paste chemistry. You can't just slap any old saponifier in there. Most water based cleaners evaporate the water and you have to remove the dried paste. It's a bit messy, maybe that's why your's is over

Necessity of ROSE in commercial quality processes

Electronics Forum | Sun Feb 26 17:40:35 EST 2006 | GS

Hi, just my comment, theoretically No Clean means no Ion Contaminants from Flux, but it some some case ion contamination (Cl-Br-F) could come out from raw PCBs, from Components, from fingerprints, etc. To incorporate a ROSE step in the pro


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