Electronics Forum: stencil (Page 504 of 540)

Strange problem with my dispenser

Electronics Forum | Tue Aug 10 15:56:30 EDT 1999 | Jason Gregory

Has anyone ever heard of this? I have a Camalot System 5000 and we were in a pinch to produce some prototype boards. We needed Sn62Pb36Ag2-no clean in a dispensing mesh. All I could get my hands on was some Interflux paste in a jar. The formulation i

Re: Competitors in Semi-Automatic Printer market?

Electronics Forum | Thu Jul 29 15:44:29 EDT 1999 | Earl Moon

Thanks Earl for your insight! I sometimes feel conspicuous as one of the few women I've seen frequenting this board, but everyone's been helpful and has resisted the overwhelming temptation to pat me on the head. From what you and some of the

Bga reballing

Electronics Forum | Thu Jul 22 21:48:21 EDT 1999 | kyung sam park

Does anyone have any experiences with bga reballing. When I had reworked failed bga part with new part It was good. So I tried to reball bga detached but failed . I guess the cause of fail is thermal shock. IS IT OK TO REBALL BGA PARTS DETACHED ?

Re: Bga reballing

Electronics Forum | Thu Jul 22 22:57:14 EDT 1999 | Earl Moon

Does anyone have any experiences with bga reballing. When I had reworked failed bga part with new part It was good. So I tried to reball bga detached but failed . I guess the cause of fail is thermal shock. IS IT OK TO REBALL BGA PARTS

Re: Bga reballing

Electronics Forum | Mon Jul 26 15:09:31 EDT 1999 | APE South

Does anyone have any experiences with bga reballing. When I had reworked failed bga part with new part It was good. So I tried to reball bga detached but failed . I guess the cause of fail is thermal shock. IS IT OK TO REBALL BGA PARTS

Re: Forum Sales

Electronics Forum | Wed Jul 28 16:05:12 EDT 1999 | Rob Fischer

Just go look at the thread on stencil cleaners started by Scott Davies in the March 1-15, 1999 achives if you want to see some juicy stuff...then make your mind up about vendor inputs. Pretty obvious if you ask me... -Steve Gregory

Re: BGA collapse during reflow

Electronics Forum | Mon Jul 12 12:28:10 EDT 1999 | Wolfgang Busko

I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye

Re: BGA collapse during reflow

Electronics Forum | Mon Jul 12 12:39:39 EDT 1999 | M Cox

I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye

Re: BGA collapse during reflow

Electronics Forum | Wed Jul 14 14:05:52 EDT 1999 | KT

I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye

Re: Through holes in SMT pads

Electronics Forum | Tue Jul 06 16:44:14 EDT 1999 | John Thorup

Is anyone aware of some guidelines regarding through-hole in SMT pads? One of our designers wants to add through-hole leads in some SMT pads for an inductor. The size of the hole is 0.032 inches and takes-up approximately 25% of the pad area. Th


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