Electronics Forum: stencil (Page 507 of 540)

Re: Intrusive soldering

Electronics Forum | Thu Mar 25 14:00:45 EST 1999 | Bob Willis

Rob, We are also using intrusive reflow to simultaneously process SMT and Thru-hole components. Our arrangement goes as follows: - Screen print solder paste to the single sided PCB using 0.008" laser cut stencil. - Apply adhesive dots

DEK fine pitch autoflex pin breakage

Electronics Forum | Fri Mar 19 19:05:27 EST 1999 | Earl Moon

Folks, I think we are getting closer to being very happy with DEK stencil printers of the 265 GSX variety. However, problems continue arising concering fine pitch autoflex tooling pin breakage. We are told by the British engineering establishment,

BGA repair/rework

Electronics Forum | Sat Mar 06 10:25:55 EST 1999 | Earl Moon

I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. Concerning the BGA stuff, I'm getting about 60% success using this rewo

Re: Solder Paste Vs Solder Paste Cartridges

Electronics Forum | Mon Feb 22 13:39:22 EST 1999 | Justin Medernach

Can anybody give me the Pros and Cons of of using Cartridges over jars and/or vice-versa. Also, if using cartridges, what is the best way to keep the paste from seperating, short of buying a mixer that cost over $5000.00 Thanks, Bill Bill,

Fuji GSP-II For Sale

Electronics Forum | Wed Feb 17 17:40:42 EST 1999 | Jerry Stafford, Jr.

Well I don't know if this is advertising or not but the registration area is down so I can't post to the used equipment section. We have a Fuji GSP-II-4000, S/N 1723, December 1993 for sale. This machine was barely used on a military project that i

Re: Fuji GSP-II For Sale

Electronics Forum | Mon Mar 08 11:14:20 EST 1999 | Skip

Well I don't know if this is advertising or not but the registration area is down so I can't post to the used equipment section. We have a Fuji GSP-II-4000, S/N 1723, December 1993 for sale. This machine was barely used on a military project that

Re: Selective Wave Solder Palletizing

Electronics Forum | Tue Feb 09 10:16:15 EST 1999 | Jim Gleason

Earl, We have found that many people get closer to a zero defect program using pallets. Since you eliminate manula masking you eliminate on huge area of possible defects production. Since the pallets can align connectors etc, you get less defects due

Re: Reliability of Reworked BGAs/CSPs

Electronics Forum | Thu Feb 04 15:44:04 EST 1999 | Michael Allen

Actually, solder paste adds about 12% to the joint volume for PBGAs, or about 31% for MicroBGAs -- assuming standard (recommended) pad sizes and stencil thicknesses, and paste with 90% metal content (50% metal by volume). I'd like to find some t

Re: Wafer Reflow Profile

Electronics Forum | Tue Feb 02 08:37:32 EST 1999 | Chris G.

Hello Everybody: I am in urgent need of some information regarding the reflow profile for a flip chip wafer. Would the reflow conditions along with the flux used affect the appearence of the solder joints. We are witnessing dull solder j

Re: 20 mil pitch applications

Electronics Forum | Tue Jan 12 00:33:30 EST 1999 | Jason

Our company is beginning to delve into some 20 mil applications and I'm curious to hear what kind of success others have had placing these components. What kind of fall out rates we might expect or any specific difficulties encountered and what


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