Electronics Forum: stencil (Page 508 of 540)

Re: Cleaning No Clean Wave Solder Carriers

Electronics Forum | Fri Jan 08 10:07:26 EST 1999 | Chrys

I'm in the process of moving from water washable flux to a full no clean process for the wave soldering process, thing's seem to be going well (so far...). The one problem I still have is cleaning the wave solder carrier's to remove the no clean

Re: Cleaning No Clean Wave Solder Carriers

Electronics Forum | Mon Jan 18 19:53:58 EST 1999 | Rob F

I'm in the process of moving from water washable flux to a full no clean process for the wave soldering process, thing's seem to be going well (so far...). The one problem I still have is cleaning the wave solder carrier's to remove the no cl

Re: CSP/BGA Assembly Problems

Electronics Forum | Tue Dec 29 11:40:24 EST 1998 | Michael Allen

I don't have answers...just comments. We're just starting to assemble CSPs on protos, and I've got the same concerns you have. The MicroBGA package I'm working with has a ball diameter of 0.325mm (0.0128") and a standoff of just 0.010" BEFORE solde

CSP/BGA Assembly Solutions

Electronics Forum | Mon Jan 04 23:15:35 EST 1999 | Kris Ewen

Where I worked, we used 0.014" square aperatures (several mfgs. have proven the benefits of square & I've seen a better transfer efficiency myself). Some mfgs use smaller edge lengths & have had success. 0.005" thick stencils give better transfer e

Pad Sizes

Electronics Forum | Thu Dec 24 01:38:36 EST 1998 | Chris Grendler

I need advice on a pad design which several other engineers whom I work with would like to try. I think it is an utterly crazy but I can't seem to convince them differently. My current 0402 chip pad sizes on alumina and FR4 substrates are .022"X.

Re: Batch Cleaners

Electronics Forum | Wed Dec 09 19:21:13 EST 1998 | Bill Schreiber

Dave, Be careful if you plan to clean misprinted PCBs in a spray type batch cleaner. There is an article written by Dick Clouthier of AMTX Stencils regarding batch cleaners and their use for cleaning misprints. He describes it as a "solder ball nig

Re: Equipment Selection - Maintenance History

Electronics Forum | Wed Oct 28 16:54:17 EST 1998 | Dave F

Sirs, what would be a good way to judge the reliability/robustness of a stencil printer or chip shooter? Does any equipment supplier specify detailed maintenance schedules? Is there a source of machine failure data (MTBF, etc.)?

Re: Solder paste print with two thicknesses

Electronics Forum | Thu Oct 08 03:27:00 EDT 1998 | Thomas Blesinger

I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the rema

Re: Solder paste print with two thicknesses

Electronics Forum | Thu Oct 08 22:32:58 EDT 1998 | Dave F

I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the re

Re: Si-Place nozel problems

Electronics Forum | Fri Oct 02 11:14:10 EDT 1998 | Scott Cook

I am experiencing solder paste comtaminatin of nozzels on 0603 size components resulting in missing components. The machine is failing to alarm under these circumstances. Has anybody else experienced this problem & found a solution? Ben, We us


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