Electronics Forum: stencil (Page 512 of 572)

Ways to control SMT gap to PCB

Electronics Forum | Thu Dec 07 19:20:28 EST 2006 | ganoi

Most likely there is movement during reflow. How about conduction oven over convection oven for reflow? This is a small PCB with the LED sitting on a Flex-Rigid extension from the PCB. I was thinking if the stencil aperature for the LED was to be cu

Streaking at Screen Printing

Electronics Forum | Sun Dec 17 14:49:57 EST 2006 | kvanzill

Well, We have several lines some products run Kester 256 and others run the Timura. I have changed the product to print on another printer and it follows. We have several products that use the same paste and similiar board design that has a problem

Solder paste handing

Electronics Forum | Sat Jan 13 03:43:38 EST 2007 | Stephen- SMT engineer trainee

We are now using solder paste(OM325) and I have some problems on the folowing process: 1. We use the solder paste softer(Malcom SP-1) to warm-up for 20 mins, when it just take from refrigerator. Is there any problems for solderpaste performance? 2.

Best pratice to reduce bridging on wave

Electronics Forum | Tue Jan 16 16:59:39 EST 2007 | realchunks

Pallet angle is usually pretty good. Lead length is also another good thing to keep as short as possible. Air Knives don't work that well. Also check your board. Make sure you have solder resist between each and every thru-hole pad. If the board

Skewed components

Electronics Forum | Mon Mar 19 05:51:24 EDT 2007 | pima

Hello I made some test on different oven and problem still occurs. The only progress is that with diffrent thermoprofil ( Ramp to Spike instead of Ramp- Soak- Spike skewed components appears at 1 % of produced parts). With Ramp - Soak-Spike we have p

i want to know what i need to made a manufacturing line for smt

Electronics Forum | Thu Mar 15 17:33:20 EDT 2007 | Darby

As you are new to this - start with lots of hair and slowly reduce. Start with one good person. Spend the money on someone who knows the process, can set it all up, (including air, power, alignment, calibration, programming, troubleshooting, stenc

Solder paste shifted from pad

Electronics Forum | Fri Mar 16 23:38:36 EDT 2007 | mika

I don't understand so please explain in more detail. You say ~0.3mm shifted. In what direction is the paste shifted? is it shifted the very same directions on all panels? Only on this product or even with regular pcb:s? What is the size of the panel

LGA36 6.5 x 3.5 mm

Electronics Forum | Sat Mar 24 03:06:55 EDT 2007 | aj

Hi Mika, We came across some difficulties with this type of device a couple of years back . After the proto run we needed to touch up the outside fillets to get stability and product to pass test. ( even though the manf. stated that there is no fill

MLF / QFN Lead Free Shorting

Electronics Forum | Mon Apr 09 16:48:27 EDT 2007 | ratsalad

How wide are your pads? What paste are you using? What is your board finish? Could you please post a link to the datasheet for the component? We place a lot of MLFs, both in a Pb and Pb-free process. Our standard stencil design for MLF compon

solder paste measurement machine

Electronics Forum | Thu Apr 26 09:03:35 EDT 2007 | ck_the_flip

3d is good for initial verification that your screen printer and stencil is producing the desired paste height. 2D verification is more than sufficient during regular production. That being said, your best bet for a 3D machine is to go cheap - buy


stencil searches for Companies, Equipment, Machines, Suppliers & Information